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参数资料
型号： MPC5553EVBISYS
厂商： Freescale Semiconductor
文件页数： 64/68页
文件大小： 0K
描述： KIT EVAL ISYSTEMS MPC5553
标准包装： 1
类型： 微控制器
适用于相关产品： MPC5553
所含物品： 评估板和演示软件
相关产品： MPC5553MZQ132-ND - IC MCU MPC5553 REV A 324-PBGA
MPC5553MZP132-ND - IC MCU MPC5553 REV A 416-PBGA
Revision History for the MPC5553 Data Sheet
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
67
Table 25 (eMIOS Timing) eMIOS Timing:
Deleted (MTS) from the heading, table, and footnotes.
Footnote 1, changed ‘VDDEH = 4.5–5.5;’ to ‘VDDEH = 4.5–5.25;’
Footnote 1: Deleted ‘FSYS = 132 MHz’, ‘VDD = 1.35–1.65 V’, ‘VDD33 and VDDSYN = 3.0–3.6 V’ and
‘and CL = 200 pF with SRC = 0b11.’
Added Footnote 2: ‘This specification does not include the rise and fall times. When calculating the minimum
eMIOS pulse width, include the rise and fall times defined in the slew rate control fields (SRC) of the pad
configuration registers (PCR).’
Figure 17 (eMIOS Timing) Added eMIOS Timing figure.
Table 26 (DSPI Timing’) DSPI Timing:
Footnote 1, changed ‘VDDEH = 4.5–5.5;’ to ‘VDDEH = 4.5–5.25;’
Table Title: Added footnote that reads: Speed is the nominal maximum frequency. Max speed is the maximum
speed allowed including frequency modulation (FM). 82 MHz parts allow for 80 MHz system clock + 2% FM;
114 MHz parts allow for 112 MHz system clock + 2% FM, and 132 MHz parts allow for 128 MHz system clock +
2% FM.
Spec 1: SCK cycle time; Changed 80 MHz = 24.4, and 112 MHz = 17.5.
Footnote 1: Changed to read: ‘All DSPI timing specifications use the fastest slew rate (SRC = 0b11) on pad type
M or MH. DSPI signals using pad types of S or SH have an additional delay based on the slew rate.’ Deleted
‘VDD = 1.35–1.65 V’ and ‘VDD33 and VDDSYN = 3.0–3.6 V.
Table 27 (EQADC SSI Timing Characteristics) EQADC SSI Timing Characteristics:
Footnote 1, changed ‘VDDEH = 4.5–5.5;’ to ‘VDDEH = 4.5–5.25;’
Deleted from table title ‘(Pads at 3.3 V or 5.0 V)’
Deleted 1st line in table ‘CLOAD = 25 pF on all outputs. Pad drive strength set to maximum.’
Spec 1: FCK frequency -- removed.
Combined footnotes 1 and 2, and moved the new footnote to Spec 2. Moved old footnote 3 that is now
footnote 2 to Spec 2.
Footnote 1, deleted ‘VDD = 1.35–1.65 V’ and ‘VDD33 and VDDSYN = 3.0–3.6V.’
Changed ‘CL = 50 pF’ to ‘CL = 25 pF.’
Footnote 2: added ‘cycle’ after ‘duty’ to read: FCK duty cycle is not 50% when. . . .
Section 3.14, “Fast Ethernet AC Timing Specifications”: Figure 28 (MII FEC Receive Signal Timing Diagram), Figure 29 (MII
FEC Transmit Signal Timing Diagram), Figure 30 (MII FEC Asynchronous Inputs Timing Diagram), and Figure 31 (MII FEC
Serial Management Channel Timing Diagram).
Removed the ‘M’ in the diagram labels that refer to the specification numbers.
Figure 37 (MPC5553 208-Pin Package)MPC5553 208 Package: Deleted the version number and date.
Figure 38 (MPC5553 324 TEPBGA Package)MPC5553 324 Package: Deleted the version number and date.
Figure 39 (MPC5553 416 TEPBGA Package) and Figure 39 (MPC5553 416 TEPBGA Package (continued))MPC5553 416
Package: Deleted the version number and date.
Table 33. Table and Figure Changes Between Rev. 2.0 and 3.0 (continued)
Location
Description of Changes
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