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| 型号： | MPC5553EVBISYS |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 66/68页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL ISYSTEMS MPC5553 |
| 标准包装： | 1 |
| 类型： | 微控制器 |
| 适用于相关产品： | MPC5553 |
| 所含物品： | 评估板和演示软件 |
| 相关产品： | MPC5553MZQ132-ND - IC MCU MPC5553 REV A 324-PBGA MPC5553MZP132-ND - IC MCU MPC5553 REV A 416-PBGA |
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Electrical Characteristics
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
7
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
相关PDF资料 |
PDF描述 |
|---|---|
| MPC5554EVB | BOARD EVALUATION MPC5554 |
| MAX6440UTMRRD3+T | IC BATTERY MON SNGL SOT23-6 |
| MAX6440UTLSYD3+T | IC BATTERY MON SNGL SOT23-6 |
| MPC5553EVBGHS | KIT EVAL GREEN HILLS SOFTWARE |
| MPC5553EVB | KIT EVAL MPC5553MZP132 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5553MVF112 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF112R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF132 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF132R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF80 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
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