- 您现在的位置：买卖IC网 > PDF目录15742 > MPC5553EVBISYS (Freescale Semiconductor)KIT EVAL ISYSTEMS MPC5553 PDF资料下载
参数资料
| 型号： | MPC5553EVBISYS |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 68/68页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL ISYSTEMS MPC5553 |
| 标准包装： | 1 |
| 类型： | 微控制器 |
| 适用于相关产品： | MPC5553 |
| 所含物品： | 评估板和演示软件 |
| 相关产品： | MPC5553MZQ132-ND - IC MCU MPC5553 REV A 324-PBGA MPC5553MZP132-ND - IC MCU MPC5553 REV A 416-PBGA |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页当前第68页
Electrical Characteristics
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
9
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using
a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple
so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple
junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat
against the package case to avoid measurement errors caused by the cooling effects of the thermocouple
wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Rd.
San Jose, CA., 95134
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applica-
tions,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and
Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
3.3
Package
The MPC5553 is available in packaged form. Read the package options in Section 2, “Ordering
Information.” Refer to Section 4, “Mechanicals,” for pinouts and package drawings.
3.4
EMI (Electromagnetic Interference) Characteristics
Table 4. EMI Testing Specifications 1
1 EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03. Qualification testing was performed on the MPC5554
and applied to the MPC5500 family as generic EMI performance data.
Spec
Characteristic
Minimum
Typical
Maximum
Unit
1
Scan range
0.15
—
1000
MHz
2
Operating frequency
—
fMAX
MHz
3VDD operating voltages
—
1.5
—
V
4VDDSYN, VRC33, VDD33, VFLASH, VDDE operating voltages
—
3.3
—
V
5VPP, VDDEH, VDDA operating voltages
—
5.0
—
V
6
Maximum amplitude
—
14 2
32 3
2 Measured with the single-chip EMI program.
3 Measured with the expanded EMI program.
dBuV
7
Operating temperature
—
25
oC
相关PDF资料 |
PDF描述 |
|---|---|
| MPC5554EVB | BOARD EVALUATION MPC5554 |
| MAX6440UTMRRD3+T | IC BATTERY MON SNGL SOT23-6 |
| MAX6440UTLSYD3+T | IC BATTERY MON SNGL SOT23-6 |
| MPC5553EVBGHS | KIT EVAL GREEN HILLS SOFTWARE |
| MPC5553EVB | KIT EVAL MPC5553MZP132 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5553MVF112 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF112R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF132 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF132R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVF80 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
发布紧急采购，3分钟左右您将得到回复。