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参数资料
| 型号： | MPC5601PEF0VLL4 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, FLASH, 64 MHz, RISC MICROCONTROLLER, PQFP100 |
| 封装： | 14 X 14 MM, 1.40 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-100 |
| 文件页数： | 36/95页 |
| 文件大小： | 1694K |
| 代理商： | MPC5601PEF0VLL4 |
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MPC5602P Microcontroller Data Sheet, Rev. 4.1
Freescale Semiconductor
41
where:
RJA = junction-to-ambient thermal resistance (°C/W)
RJC = junction-to-case thermal resistance (°C/W)
RCA = case-to-ambient thermal resistance (°C/W)
RJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the
case-to-ambient thermal resistance, RCA. For instance, the user can change the size of the heat sink, the air flow around the
device, the interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the
printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal
Characterization Parameter (
JT) can be used to determine the junction temperature with a measurement of the temperature at
the top center of the package case using Equation 3:
TJ = TT + (JT x PD)
Eqn. 3
where:
TT = thermocouple temperature on top of the package (°C)
JT = thermal characterization parameter (°C/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134U.S.A.
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at (800)
854-7179 or (303) 397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
C.E. Triplett and B. Joiner, An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller
Module, Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
G. Kromann, S. Shidore, and S. Addison, Thermal Modeling of a PBGA for Air-Cooled Applications, Electronic
Packaging and Production, pp. 53–58, March 1998.
B. Joiner and V. Adams, Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in
Thermal Modeling, Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
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