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参数资料
| 型号： | MPC7400RX350TX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 32/44页 |
| 文件大小： | 744K |
| 代理商： | MPC7400RX350TX |
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38
MPC7400 RISC Microprocessor Hardware Specications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
Figure 23. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC7400. There are
several commercially-available heat sinks for the MPC7400 provided by the following vendors:
Chip Coolers Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
International Electronic Research Corporation (IERC)818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Thermalloy
214-243-4321
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
Wakeeld Engineering
617-245-5900
60 Audubon Rd.
Wakeeld, MA 01880
Aavid Engineering
603-528-3400
One Kool Path
Laconia, NH 03247-0440
Ultimately, the nal selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.8.9.1 Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 3, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
Adhesive
or
Thermal Interface Material
Heat Sink
CBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
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For More Information On This Product,
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