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参数资料
| 型号： | MPC7400RX350TX |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 44/44页 |
| 文件大小： | 744K |
| 代理商： | MPC7400RX350TX |
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MPC7400 RISC Microprocessor Hardware Specications
9
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Electrical and Thermal Characteristics
Table 3 provides the recommended operating conditions for the MPC7400.
Table 4 provides the package thermal characteristics for the MPC7400.
The MPC7400 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-
to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the
MPC7400 RISC Microprocessor User’s Manual for more information on the use of this feature.
Specications for the thermal sensor portion of the TAU are found in Table 5.
Table 3. Recommended Operating Conditions
Characteristic
Symbol
Recommended
Value
Unit
Note
Core supply voltage
Vdd
1.8v ± 100mv
V
1
PLL supply voltage
AVdd
1.8v ± 100mv
V
1
L2 DLL supply voltage
L2AVdd
1.8v ± 100mv
V
1
Processor bus supply
voltage
BVSEL = 0
OVdd
1.8v ± 100mv
V
1
BVSEL = HRESET
OVdd
2.5v ± 100mv
V
1
BVSEL = 1
OVdd
3.3v ± 165mv
V
1
L2 bus supply voltage
L2VSEL = 0
L2OVdd
1.8v ± 100mv
V
1
L2VSEL = HRESET
L2OVdd
2.5v ± 100mv
V
1
L2VSEL = 1
L2OVdd
3.3v ± 165mv
V
1
Input voltage
Processor bus
Vin
GND to OVdd
V
1
L2 Bus
Vin
GND to L2OVdd
V
1
JTAG Signals
Vin
GND to OVdd
V
1
Die-junction temperature
Tj
0 to 105
°C
2
Note:
1. These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
2. The extended temperature parts have die-junction temperature of -40 to 105 C.
Table 4. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
CBGA package thermal resistance, junction-to-case thermal resistance (typical)
θJC
0.03
°C/W
CBGA package thermal resistance, die junction-to-lead thermal resistance
(typical)
θJB
3.8
°C/W
Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
Table 5. Thermal Sensor Specifications
At recommended operating conditions (See Table 3)
Characteristic
Min
Max
Unit
Notes
Temperature range
0
127
°C
1
Comparator settling time
20
—
s
2
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