- 您现在的位置：买卖IC网 > PDF目录67998 > MPC7450RX600LX (MOTOROLA INC) 32-BIT, 600 MHz, RISC PROCESSOR, CBGA483 PDF资料下载
参数资料
| 型号： | MPC7450RX600LX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA483 |
| 封装： | 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483 |
| 文件页数： | 49/60页 |
| 文件大小： | 1296K |
| 代理商： | MPC7450RX600LX |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页当前第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页
MPC7450 RISC Microprocessor Hardware Specifications
53
System Design Information
(pulled down). While shown on the COP header, not all emulator products drive this signal. To preserve
correct power down operation, QACK should be merged so that it also can be driven by the PCI bridge.
Table 21 shows the pin definitions for the pin numbering shown in Figure 26.
1.9.9 Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly (see Figure 27); however, due to the potential large mass
of the heat sink, attachment through the printed circuit board is suggested. If a spring clip is used, the spring
force should not exceed 5.5 pounds.
Table 21. COP Pin Definitions
Pins
Signal
Connection
Special Notes
1TDO
TDO
2
QACK
Add 2K pull-down to ground. Must be merged with on-board
QACK, if any.
3TDI
TDI
4TRST
TRST
Add 2K pull-down to ground. Must be merged with on-board
TRST, if any. See Figure 25
5
RUN/STOP
No Connect
Not used
6
VDD_SENSE
VDD
Add 2K pull-up to OVDD (for short circuit limiting protection
only).
7TCK
TCK
8CKSTP_IN
CKSTP_IN
Optional. Add 10K pull-up to OVDD. Used on several emulator
products. Useful for checkstopping the processor from a logic
analyzer or other external trigger.
9TMS
TMS
10
N/A
—
11
SRESET
Merge with on-board SRESET, if any.
12
N/A
—
13
HRESET
Merge with on-board HRESET.
14
N/A
—
Key location; pin should be removed.
15
CKSTP_OUT
Add 10K pull-up to VDD.
16
Ground
Digital Ground
相关PDF资料 |
PDF描述 |
|---|---|
| MPC8241TZQ200D | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357 |
| MPC8241LVR266D | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357 |
| MPC8241LVR166D | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357 |
| MPC8241LZQ166D | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357 |
| MPC8241TZQ166D | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC7455 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC7457 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC7457EC | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC745BPX300LE | 功能描述:微处理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC745BPX350LE | 功能描述:微处理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
发布紧急采购，3分钟左右您将得到回复。