- 您现在的位置：买卖IC网 > PDF目录67998 > MPC7450RX600LX (MOTOROLA INC) 32-BIT, 600 MHz, RISC PROCESSOR, CBGA483 PDF资料下载
参数资料
| 型号： | MPC7450RX600LX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA483 |
| 封装： | 29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483 |
| 文件页数： | 7/60页 |
| 文件大小： | 1296K |
| 代理商： | MPC7450RX600LX |
第1页第2页第3页第4页第5页第6页当前第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页
MPC7450 RISC Microprocessor Hardware Specifications
15
Electrical and Thermal Characteristics
The MPC7450 incorporates a thermal management assist unit (TAU) composed of a thermal sensor,
digital-to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See
the MPC7450 RISC Microprocessor User’s Manual for more information on the use of this feature.
Specifications for the thermal sensor portion of the TAU are found in Table 6.
Table 7 provides the DC electrical characteristics for the MPC7450.
Table 5. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
CBGA package thermal resistance, junction-to-case thermal resistance
(typical)
θ
JC
<0.1
°C/W
CBGA package thermal resistance, die junction-to-lead thermal resistance
(typical)
θ
JB
2.2
°C/W
Note: Refer to Section 1.9, “System Design Information,” for more details about thermal management.
Table 6. Thermal Sensor Specifications
At recommended operating condition. See Table 4.
Characteristic
Min
Max
Unit
Notes
Temperature range
0
127
°C
1
Comparator settling time
20
—
s
2
Resolution
4
—
°C
3
Accuracy
–12
+12
°C
3
Notes:
1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an
absolute temperature, but it must be interpreted by software to derive the absolute junction temperature. For
information about the use and calibration of the TAU, see Motorola application note, “Programming the Thermal
Assist Unit in the MPC750 Microprocessor,” (order #: AN1800/D).
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into
the THRM3 SPR.
3. Guaranteed by design and characterization.
相关PDF资料 |
PDF描述 |
|---|---|
| MPC8241TZQ200D | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357 |
| MPC8241LVR266D | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA357 |
| MPC8241LVR166D | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357 |
| MPC8241LZQ166D | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357 |
| MPC8241TZQ166D | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC7455 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC7457 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC7457EC | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC745BPX300LE | 功能描述:微处理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC745BPX350LE | 功能描述:微处理器 - MPU 255 PBGAREV2.8105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
发布紧急采购，3分钟左右您将得到回复。