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参数资料
| 型号： | MPC755BRX350LE |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 26/60页 |
| 文件大小： | 1559K |
| 代理商： | MPC755BRX350LE |
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MPC755 RISC Microprocessor Hardware Specifications, Rev. 7.0
32
Freescale Semiconductor
Package Description
7
Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC745, 255
PBGA package, as well as the MPC755, 360 CBGA and PBGA packages. While both the MPC755 plastic
and ceramic packages are described here, both packages are not guaranteed to be available at the same
time. All new designs should allow for either ceramic or plastic BGA packages for this device. For more
information on designing a common footprint for both plastic and ceramic package types, see the
Freescale Flip-Chip Plastic Ball Grid Array Presentation. The MPC755 was initially sampled in a CBGA
package, but production units are currently provided in both a CBGA and a PBGA package. Because of
the better long-term device-to-board interconnect reliability of the PBGA package, Freescale recommends
use of a PBGA package except where circumstances dictate use of a CBGA package.
7.1
Package Parameters for the MPC745 PBGA
The package parameters are as provided in the following list. The package type is 21
× 21 mm, 255-lead
plastic ball grid array (PBGA).
Package outline
21
× 21 mm
Interconnects
255 (16
× 16 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.25 mm
WT
C3
Low
Output
OVDD
VDD
G8, G10, G12, J8, J10, J12, L8, L10, L12, N8,
N10, N12
—
2.0 V
VOLTDET
K13
High
Output
L2OVDD
8
Notes:
1. OVDD supplies power to the processor bus, JTAG, and all control signals except the L2 cache controls (L2CE,
L2WE, and L2ZZ); L2OVDD supplies power to the L2 cache interface (L2ADDR[0:16], L2DATA[0:63], L2DP[0:7], and
L2SYNC_OUT) and the L2 control signals; and VDD supplies power to the processor core and the PLL and DLL
(after filtering to become AVDD and L2AVDD, respectively). These columns serve as a reference for the nominal
voltage supported on a given signal as selected by the BVSEL/L2VSEL pin configurations of Table 2 and the voltage
2. These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.
3. This pin must be pulled up to OVDD for proper operation of the processor interface. To allow for future I/O voltage
changes, provide the option to connect BVSEL independently to either OVDD or GND.
4. These pins are reserved for potential future use as additional L2 address pins.
5. Uses one of nine existing no connects in the MPC750, 360 BGA package.
6. Internal pull-up on die.
7. This pin must be pulled up to L2OVDD for proper operation of the processor interface. To allow for future I/O voltage
changes, provide the option to connect L2VSEL independently to either L2OVDD or GND.
8. Internally tied to L2OVDD in the MPC755, 360 BGA package to indicate the power present at the L2 cache interface.
This signal is not a power supply input.
Caution: This differs from the MPC745, 255 BGA package.
Table 15. Pinout Listing for the MPC755, 360 BGA Package (continued)
Signal Name
Pin Number
Active
I/O
I/F Voltage 1
Notes
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相关代理商/技术参数 |
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| MPC755BRX350TE | 功能描述:微处理器 - MPU 360CBGA,RV2.8,HIP4DP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC755BVT300LE | 功能描述:微处理器 - MPU RV2.8106C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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| MPC755CPX400LE | 功能描述:微处理器 - MPU GF RV2.8360PBGA 4A105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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