参数资料
型号: MPC755BRX350LE
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 48/60页
文件大小: 1559K
代理商: MPC755BRX350LE
MPC755 RISC Microprocessor Hardware Specifications, Rev. 7.0
52
Freescale Semiconductor
Document Revision History
3
Updated format and thermal resistance specifications of Table 4.
Reformatted Tables 9, 10, 11, and 12.
Added dimensions A3, D1, and E1 to Figures 18, 19, and 20.
Revised Section 1.8.7 and Figure 25, removed Figure 26 and Table 19 (information now included in
Figure 25).
Reformatted Section 1.10.
Clarified address bus and address attribute pull-up recommendations in Section 1.8.7.
Clarified Table 2.
Updated voltage sequencing requirements in Table 1 and removed Section 1.8.3.
2
1.8 V/2.0 V mode no longer supported; added 2.5 V support.
Removed 1.8 V/2.0 V mode data from Tables 2, 3, and 6.
Added 2.5 V mode data to Tables 2, 3, and 6.
Extended recommended operating voltage (down to 1.8 V) for VDD, AVDD, and L2AVDD for 300 and
350 MHz parts in Table 3.
Updated Table 7 and test conditions for power consumption specifications.
Corrected Note 6 of Table 9 to include TLBISYNC as a mode-select signal.
Updated AC timing specifications in Table 10.
Updated AC timing specifications in Table 12.
Corrected AC timing specifications in Table 13.
Added L1_TSTCLK, L2_TSTCLK, and LSSD_MODE pull-up requirements to Section 1.8.6.
Corrected Figure 22.
Table 19. Document Revision History (continued)
Revision
Date
Substantive Change(s)
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相关代理商/技术参数
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