- 您现在的位置：买卖IC网 > PDF目录45357 > MPC8266AZUPIBX (MOTOROLA INC) 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480 PDF资料下载
参数资料
| 型号： | MPC8266AZUPIBX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480 |
| 封装： | 37.50 X 37.50 MM, 1.27 MM PITCH, TBGA-480 |
| 文件页数： | 16/111页 |
| 文件大小： | 1007K |
| 代理商： | MPC8266AZUPIBX |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页当前第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页
12
MPC826xA (HiP4) Family Hardware Specications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Electrical and Thermal Characteristics
1.2.2
Thermal Characteristics
Table 6 describes thermal characteristics.
1.2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θJA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and TJ
is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving
equations (1) and (2) iteratively for any value of TA.
1.2.3.1
Layout Practices
Each VCC pin should be provided with a low-impedance path to the board’s power supply. Each ground pin
should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The VCC power supply should be bypassed to ground using at least four 0.1 F
by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads and
associated printed circuit traces connecting to chip VCC and ground should be kept to less than half an inch
per capacitor lead. A four-layer board is recommended, employing two inner layers as VCC and GND planes.
Table 6. Thermal Characteristics
Characteristics
Symbol
Value
Unit
Air Flow
Thermal resistance for TBGA
θJA
13.071
1 Assumes a single layer board with no thermal vias
°C/W
NC2
2 Natural convection
θJA
°C/W
1 m/s
θJA
10.483
3 Assumes a four layer board
°C/W
NC
θJA
°C/W
1 m/s
相关PDF资料 |
PDF描述 |
|---|---|
| MPC8264AZUMIBX | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA480 |
| MPC8264AZUPIBX | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480 |
| MPC8265ACZUMHBC | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA480 |
| MPC8260ACZUIHBX | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA480 |
| MPC8260AZUIHBX | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA480 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8266AZUPJDC | 功能描述:微处理器 - MPU POWER QUICC II HIP4C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8266CVR | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8266CZU | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8266VR | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8266ZU | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
发布紧急采购，3分钟左右您将得到回复。