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参数资料
| 型号： | MPC8266AZUPIBX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA480 |
| 封装： | 37.50 X 37.50 MM, 1.27 MM PITCH, TBGA-480 |
| 文件页数： | 17/111页 |
| 文件大小： | 1007K |
| 代理商： | MPC8266AZUPIBX |
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MOTOROLA
MPC826xA (HiP4) Family Hardware Specications
13
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Electrical and Thermal Characteristics
All output pins on the MPC826xA have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize overdamped conditions and reections caused by these
fast output switching times. This recommendation particularly applies to the address and data buses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs
during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
Table 7 provides preliminary, estimated power dissipation for various congurations. Note that suitable
thermal management is required for conditions above PD = 3W (when the ambient temperature is 70 C or
greater) to ensure the junction temperature does not exceed the maximum specied value. Also note that the
I/O power should be included when determining whether to use a heat sink.
1.2.4
AC Electrical Characteristics
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and
inputs for the 66 MHz MPC826xA device. Note that AC timings are based on a 50-pf load. Typical output
buffer impedances are shown in Table 8.
Table 7. Estimated Power Dissipation for Various Congurations1
1 Test temperature = room temperature (25 C)
Bus
(MHz)
CPM
Multiplier
Core CPU
Multiplier
CPM
(MHz)
CPU
(MHz)
PINT(W)
2
2 P
INT = IDD x VDD Watts
Vddl 1.8 Volts
Vddl 2.0 Volts
Nominal
Maximum
Nominal
Maximum
66.66
2
3
133
200
1.2
2
1.8
2.3
66.66
2.5
3
166
200
1.3
2.1
1.9
2.3
66.66
3
4
200
266
—
2.3
2.9
66.66
3
4.5
200
300
—
2.4
3.1
83.33
2
3
166
250
—
2.2
2.8
83.33
2
3
166
250
—
2.2
2.8
83.33
2.5
3.5
208
291
—
2.4
3.1
Table 8. Output Buffer Impedances1
1 These are typical values at 65 C. The impedance may vary
by ±25% with process and temperature.
Output Buffers
Typical Impedance ()
60x bus
40
Local bus
40
Memory controller
40
Parallel I/O
46
PCI
25
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相关代理商/技术参数 |
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|---|---|
| MPC8266AZUPJDC | 功能描述:微处理器 - MPU POWER QUICC II HIP4C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8266CVR | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8266CZU | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8266VR | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
| MPC8266ZU | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:MPC826xA (HiP4) Family Hardware Specifications |
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