参数资料
型号: MPC8309VMAFDCA
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 333 MHz, RISC PROCESSOR, PBGA489
封装: 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-489
文件页数: 75/81页
文件大小: 484K
代理商: MPC8309VMAFDCA
MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
Freescale Semiconductor
77
System Design Information
to minimize inductance. Suggested bulk capacitors—100 to 330 F (AVX TPS tantalum or Sanyo
OSCON).
25.4
Output Buffer DC Impedance
For all buses, the driver is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 47). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 =(RP +RN)/2.
Figure 47. Driver Impedance Measurement
The value of this resistance and the strength of the driver’s current source can be found by making two
measurements. First, the output voltage is measured while driving logic 1 without an external differential
termination resistor. The measured voltage is V1 = Rsource Isource. Second, the output voltage is measured
while driving logic 1 with an external precision differential termination resistor of value Rterm. The
measured voltage is V2 =(1/(1/R1 +1/R2)) Isource. Solving for the output impedance gives
Rsource =Rterm (V1/V2 – 1). The drive current is then Isource =V1/Rsource.
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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