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参数资料
| 型号： | MPC8315VRAGDA |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 400 MHz, MICROPROCESSOR, PBGA620 |
| 封装： | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-620 |
| 文件页数： | 9/112页 |
| 文件大小： | 1283K |
| 代理商： | MPC8315VRAGDA |
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MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 0
106
Freescale Semiconductor
System Design Information
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb force (45
Newtons). If an adhesive attachment is planned, the adhesive should be intended for attachment to painted
or plastic surfaces and its performance verified under the application requirements.
25.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink temperature and
then back calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction to case
thermal resistance.
TJ = TC + (RθJC x PD)
Where
TC is the case temperature of the package
RθJC is the junction-to-case thermal resistance
PD is the power dissipation
26 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8315E.
26.1
System Clocking
The MPC8315E includes two PLLs.
1. The platform PLL (AVDD2) generates the platform clock from the externally supplied
SYS_CLKIN input. The frequency ratio between the platform and SYS_CLKIN is selected using
the platform PLL ratio configuration bits as described in Section 24.1, “System PLL
2. The e300 Core PLL (AVDD1) generates the core clock as a slave to the platform clock. The
frequency ratio between the e300 core clock and the platform clock is selected using the e300
PLL ratio configuration bits as described in Section 24.2, “Core PLL Configuration.”
26.2
PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins
(AVDD1,AVDD2 respectively). The AVDD level should always be equivalent to VDD, and preferably
these voltages are derived directly from VDD through a low frequency filter scheme such as the following.
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