参数资料
型号: MPC8323ECZQAFDC
厂商: Freescale Semiconductor
文件页数: 44/82页
文件大小: 0K
描述: IC MPU PWRQUICC II 516-PBGA
产品培训模块: MPC8323E PowerQUICC II Pro Processor
标准包装: 40
系列: MPC83xx
处理器类型: 32-位 MPC83xx PowerQUICC II Pro
速度: 333MHz
电压: 1V
安装类型: 表面贴装
封装/外壳: 516-BBGA
供应商设备封装: 516-FPBGA(27x27)
包装: 托盘
配用: MPC8323E-RDB-ND - BOARD REFERENCE DESIGN
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
49
Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8323E is available in
a thermally enhanced Plastic Ball Grid Array (PBGA); see Section 21.1, “Package Parameters for the
information on the PBGA.
21.1
Package Parameters for the MPC8323E PBGA
The package parameters are as provided in the following list. The package type is 27 mm
× 27 mm, 516
PBGA.
Package outline
27 mm
× 27 mm
Interconnects
516
Pitch
1.00 mm
Module height (typical)
2.25 mm
Solder Balls
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
Ball diameter (typical)
0.6 mm
21.2
Mechanical Dimensions of the MPC8323E PBGA
Figure 42 shows the mechanical dimensions and bottom surface nomenclature of the MPC8323E,
516-PBGA package.
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MPC8323ECZQAFDCA 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications
MPC8323EEC 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications
MPC8323E-MDS-PB 功能描述:开发板和工具包 - 其他处理器 MPC8323E PROCESSOR BOARD RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压:
MPC8323E-RDB 功能描述:开发板和工具包 - 其他处理器 REFERENCE DESIGN PQII PR RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压:
MPC8323E-RDB 制造商:Freescale Semiconductor 功能描述:MPC8323E Integrated Multiservice Gateway