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参数资料
| 型号： | MPC8323ECZQAFDC |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 71/82页 |
| 文件大小： | 0K |
| 描述： | IC MPU PWRQUICC II 516-PBGA |
| 产品培训模块： | MPC8323E PowerQUICC II Pro Processor |
| 标准包装： | 40 |
| 系列： | MPC83xx |
| 处理器类型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 333MHz |
| 电压： | 1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 516-BBGA |
| 供应商设备封装： | 516-FPBGA（27x27） |
| 包装： | 托盘 |
| 配用： | MPC8323E-RDB-ND - BOARD REFERENCE DESIGN |
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MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
73
Thermal
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RθJB × PD)
where:
TJ = junction temperature (°C)
TB = board temperature at the package perimeter (°C)
RθJB = junction-to-board thermal resistance (°C/W) per JESD51-8
PD = power dissipation in package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
23.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
Ψ
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
TJ = junction temperature (°C)
TT = thermocouple temperature on top of package (°C)
Ψ
JT = thermal characterization parameter (°C/W)
PD = power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
23.2.4
Heat Sinks and Junction-to-Case Thermal Resistance
In some application environments, a heat sink is required to provide the necessary thermal management of
the device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case
thermal resistance and a case to ambient thermal resistance:
RθJA = RθJC + RθCA
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8323ECZQAFDCA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
| MPC8323EEC | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
| MPC8323E-MDS-PB | 功能描述:开发板和工具包 - 其他处理器 MPC8323E PROCESSOR BOARD RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8323E-RDB | 功能描述:开发板和工具包 - 其他处理器 REFERENCE DESIGN PQII PR RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8323E-RDB | 制造商:Freescale Semiconductor 功能描述:MPC8323E Integrated Multiservice Gateway |
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