- 您现在的位置：买卖IC网 > PDF目录3965 > MPC8323ECZQAFDC (Freescale Semiconductor)IC MPU PWRQUICC II 516-PBGA PDF资料下载
参数资料
| 型号： | MPC8323ECZQAFDC |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 75/82页 |
| 文件大小： | 0K |
| 描述： | IC MPU PWRQUICC II 516-PBGA |
| 产品培训模块： | MPC8323E PowerQUICC II Pro Processor |
| 标准包装： | 40 |
| 系列： | MPC83xx |
| 处理器类型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 333MHz |
| 电压： | 1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 516-BBGA |
| 供应商设备封装： | 516-FPBGA（27x27） |
| 包装： | 托盘 |
| 配用： | MPC8323E-RDB-ND - BOARD REFERENCE DESIGN |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页当前第75页第76页第77页第78页第79页第80页第81页第82页
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
77
System Design Information
Each circuit should be placed as close as possible to the specific AVDD pin being supplied to minimize
noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AVDD
pin, which is on the periphery of package, without the inductance of vias.
Figure 44 shows the PLL power supply filter circuit.
Figure 44. PLL Power Supply Filter Circuit
24.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the MPC8323E can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the MPC8323E system, and the
MPC8323E itself requires a clean, tightly regulated source of power. Therefore, it is recommended that
the system designer place at least one decoupling capacitor at each VDD, OVDD, and GVDD pins of the
MPC8323E. These decoupling capacitors should receive their power from separate VDD, OVDD, GVDD,
and GND power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be
placed directly under the device using a standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, OVDD, and GVDD planes, to enable quick recharging of the smaller chip capacitors.
These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick
response time necessary. They should also be connected to the power and ground planes through two vias
to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS tantalum or Sanyo OSCON).
24.4
Connection Recommendations
To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to OVDD, or GVDD as required. Unused active high inputs
should be connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, GVDD, OVDD, and GND pins of the
MPC8323E.
24.5
Output Buffer DC Impedance
The MPC8323E drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 45). The
VDD
AVDD (or L2AVDD)
2.2 F
GND
Low ESL Surface Mount Capacitors (<0.5 nH)
10
Ω
相关PDF资料 |
PDF描述 |
|---|---|
| IDT70V3589S133DR | IC SRAM 2MBIT 133MHZ 208QFP |
| MPC8323ECZQADDC | IC MPU PWRQUICC II 516-PBGA |
| IDT70V3589S133BCI | IC SRAM 2MBIT 133MHZ 256BGA |
| MPC8349ECZUAGDB | IC MPU PWRQUICC II 672-TBGA |
| IDT70V3399S133PRF | IC SRAM 2MBIT 133MHZ 128TQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8323ECZQAFDCA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
| MPC8323EEC | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
| MPC8323E-MDS-PB | 功能描述:开发板和工具包 - 其他处理器 MPC8323E PROCESSOR BOARD RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8323E-RDB | 功能描述:开发板和工具包 - 其他处理器 REFERENCE DESIGN PQII PR RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8323E-RDB | 制造商:Freescale Semiconductor 功能描述:MPC8323E Integrated Multiservice Gateway |
发布紧急采购，3分钟左右您将得到回复。