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| 型号： | MPC8349ZUALF |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 667 MHz, MICROPROCESSOR, PBGA672 |
| 封装： | 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672 |
| 文件页数： | 72/88页 |
| 文件大小： | 1014K |
| 代理商： | MPC8349ZUALF |
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MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10
74
Freescale Semiconductor
Thermal
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Generally, the value obtained on a single-layer board is appropriate for
a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated. Test cases have
demonstrated that errors of a factor of two (in the quantity TJ –TA) are possible.
20.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
20.2.3
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, use
the thermal characterization parameter (
Ψ
JT) to determine the junction temperature and a measure of the
temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
TJ = junction temperature (°C)
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| MPC8349ZUALFB | 功能描述:微处理器 - MPU 8349 TBGA W/O ENCRYP RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8358 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC⑩ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications |
| MPC8358CVRADDDA | 功能描述:微处理器 - MPU 8358 PBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8358CVRAGDDA | 功能描述:微处理器 - MPU 8358 PBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8358CVRAGDGA | 功能描述:微处理器 - MPU 8358 PBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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