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参数资料
| 型号： | MPC8349ZUALF |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 667 MHz, MICROPROCESSOR, PBGA672 |
| 封装： | 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672 |
| 文件页数： | 79/88页 |
| 文件大小： | 1014K |
| 代理商： | MPC8349ZUALF |
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MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10
80
Freescale Semiconductor
System Design Information
21.3
Decoupling Recommendations
Due to large address and data buses and high operating frequencies, the MPC8349E can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the MPC8349E system, and the
MPC8349E itself requires a clean, tightly regulated source of power. Therefore, the system designer
should place at least one decoupling capacitor at each VDD, OVDD, GVDD, and LVDD pin of the
MPC8349E. These capacitors should receive their power from separate VDD, OVDD, GVDD, LVDD, and
GND power planes in the PCB, with short traces to minimize inductance. Capacitors can be placed directly
under the device using a standard escape pattern. Others can surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, distribute several bulk storage capacitors around the PCB, feeding the VDD, OVDD, GVDD,
and LVDD planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should
have a low ESR (equivalent series resistance) rating to ensure the quick response time. They should also
be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk
capacitors are 100–330 F (AVX TPS tantalum or Sanyo OSCON).
21.4
Connection Recommendations
To ensure reliable operation, connect unused inputs to an appropriate signal level. Unused active low
inputs should be tied to OVDD, GVDD, or LVDD as required. Unused active high inputs should be
connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins of
the MPC8349E.
21.5
Output Buffer DC Impedance
The MPC8349E drivers are characterized over process, voltage, and temperature. For all buses, the driver
is a push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 41). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
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| MPC8358CVRADDDA | 功能描述:微处理器 - MPU 8358 PBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8358CVRAGDDA | 功能描述:微处理器 - MPU 8358 PBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8358CVRAGDGA | 功能描述:微处理器 - MPU 8358 PBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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