参数资料
型号: MPC8544DVTANG
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 400 MHz, MICROPROCESSOR, PBGA783
封装: 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FC-PBGA-783
文件页数: 14/128页
文件大小: 1411K
代理商: MPC8544DVTANG
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
110
Freescale Semiconductor
Thermal
The heat sink-to-ambient thermal resistance (
θSA) versus airflow velocity for a Thermalloy heat sink
#2328B is shown in Figure 64.
Assuming an air velocity of 1 m/s, we have an effective
θSA+ of about 5°C/W, thus
TJ = 30°C + 5°C + (0.1°C/W + 1.0°C/W + 5°C/W) × 5
resulting in a die-junction temperature of approximately 66, which is well within the maximum operating
temperature of the component.
Figure 64. Approach Air Velocity (m/s)
20.3.4
Temperature Diode
The MPC8544E has a temperature diode on the microprocessor that can be used in conjunction with other
system temperature monitoring devices (such as Analog Devices, ADT7461). These devices use the
negative temperature coefficient of a diode operated at a constant current to determine the temperature of
the microprocessor and its environment. For proper operation, the monitoring device used should
auto-calibrate the device by canceling out the VBE variation of each MPC8544E internal diode.
The following are the specifications of the MPC8544E on-board temperature diode:
Vf > 0.40 V
Vf < 0.90 V
Operating range 2–300
μA
Diode leakage < 10 nA @ 125
°C
Ideality factor over 5–150
μA at 60°C: n = 1.085 ± 0.2%
1
3
5
7
8
0
0.511.5
22.5
33.5
Thermalloy #2328B Pin-fin Heat Sink
H
eat
Si
nk
The
rm
a
l
R
e
si
st
a
n
ce
C/
W
)
(25
× 28 × 15 mm)
2
4
6
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