参数资料
型号: MPC8569EVTAUNL
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: RISC PROCESSOR, PBGA783
封装: 29 X 29 MM, 1 MM PITCH, PLASTIC, BGA-783
文件页数: 23/126页
文件大小: 2847K
代理商: MPC8569EVTAUNL
Thermal Management Information
MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
Freescale Semiconductor
119
3.3
Thermal Management Information
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,
and thermal interface material.
The recommended attachment method to the heat sink is illustrated in the following figure. The heat sink must be attached to
the printed-circuit board with the spring force centered over the package. This spring force should not exceed 10 pounds force
(45 Newtons).
Figure 73. Package Exploded Cross-Sectional View
The system board designer can choose among several types of commercially-available heat sinks to determine the appropriate
one to place on the device. Ultimately, the final selection of an appropriate heat sink depends on factors such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
3.3.1
Internal Package Conduction Resistance
For the package, the intrinsic internal conduction thermal resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Adhesive or
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Thermal Interface Material
Die
Die Lid
相关PDF资料
PDF描述
MPC8569ECVTAQLJA RISC PROCESSOR, PBGA783
MPC8569EVTANKGB RISC PROCESSOR, PBGA783
MPC8569EVTAQLJA RISC PROCESSOR, PBGA783
MPC8569VTAQLJA RISC PROCESSOR, PBGA783
MPC8569ECVTANKGA RISC PROCESSOR, PBGA783
相关代理商/技术参数
参数描述
MPC8569EVTAUNLB 功能描述:数字信号处理器和控制器 - DSP, DSC 8569 1.33GHz rev2.1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MPC8569VJAUNLB 制造商:Freescale Semiconductor 功能描述:IC MPU PWRQUICC 1333MHZ 783FCBGA
MPC8569VTANKGB 功能描述:数字信号处理器和控制器 - DSP, DSC 8569 ST 800/600/400 r2.1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MPC8569VTAQLJB 功能描述:数字信号处理器和控制器 - DSP, DSC 8569 ST 1067/667/533 r2.1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
MPC8569VTAUNLB 功能描述:数字信号处理器和控制器 - DSP, DSC 8569 ST 1333/667/533 r2.1 RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT