参数资料
型号: MPC870ZT80
厂商: 飞思卡尔半导体(中国)有限公司
英文描述: Hardware Specifications
中文描述: 硬件规格
文件页数: 12/84页
文件大小: 1366K
代理商: MPC870ZT80
MPC875/MPC870 Hardware Specifications, Rev. 3.0
2
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor
Features
Table 1 shows the functionality supported by the members of the MPC875/MPC870.
2Features
The MPC875/870 is comprised of three modules that each use the 32-bit internal bus: a MPC8xx core, a system
integration unit (SIU), and a communications processor module (CPM).
The following list summarizes the key MPC875/870 features:
Embedded MPC8xx core up to 133 MHz
Maximum frequency operation of the external bus is 80 MHz (in 1:1 mode)
— The 133-MHz core frequency supports 2:1 mode only.
— The 66-/80-MHz core frequencies support both the 1:1 and 2:1 modes.
Single-issue, 32-bit core (compatible with the PowerPC architecture definition) with thirty-two 32-bit
general-purpose registers (GPRs)
— The core performs branch prediction with conditional prefetch and without conditional execution.
— 8-Kbyte data cache and 8-Kbyte instruction cache (see Table 1)
– Instruction cache is two-way, set-associative with 256 sets in 2 blocks
– Data cache is two-way, set-associative with 256 sets
– Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache
blocks.
– Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and
are lockable on a cache block basis.
— MMUs with 32-entry TLB, fully associative instruction and data TLBs
— MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces
and 16 protection groups
— Advanced on-chip emulation debug mode
Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
32 address lines
Memory controller (eight banks)
— Contains complete dynamic RAM (DRAM) controller
— Each bank can be a chip select or RAS to support a DRAM bank.
— Up to 30 wait states programmable per memory bank
— Glueless interface to DRAM, SIMMS, SRAM, EPROMs, Flash EPROMs, and other memory devices
— DRAM controller programmable to support most size and speed memory interfaces
— Four CAS lines, four WE lines, and one OE line
Table 1. MPC875/870 Devices
Part
Cache
Ethernet
SCC
SMC
USB
Security
Engine
I Cache
D Cache
10BaseT
10/100
MPC875
8 Kbyte
1
2
1
Yes
MPC870
8 Kbyte
2
1
No
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MPC870ZTZZ 制造商:Freescale Semiconductor 功能描述:
MPC875CVR133 功能描述:微处理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC875CVR66 功能描述:微处理器 - MPU 66 MHz 87 MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC875CZT133 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC875CZT66 功能描述:微处理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324