参数资料
型号: MRF6V3090NR5
厂商: Freescale Semiconductor
文件页数: 10/19页
文件大小: 942K
描述: FET RF N-CH 860MHZ 50V TO270-4
标准包装: 50
晶体管类型: LDMOS
频率: 860MHz
增益: 22dB
电压 - 测试: 50V
电流 - 测试: 350mA
功率 - 输出: 18W
电压 - 额定: 110V
封装/外壳: TO-270AB
供应商设备封装: TO-270 WB-4
包装: 带卷 (TR)
18
RF Device Data
Freescale Semiconductor, Inc.
MRF6V3090NR1 MRF6V3090NR5
MRF6V3090NBR1 MRF6V3090NBR5
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following documents, software and tools to aid your design process.
Application Notes
?
AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages
?
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
?
AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages
?
AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages
Engineering Bulletins
?
EB212: Using Data Sheet Impedances for RF LDMOS Devices
Software
?
Electromigration MTTF Calculator
?
RF High Power Model
?
.s2p File
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the ?Part Number? link. Go to the
Software & Tools tab on the part?s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
Apr. 2010
?
Initial Release of Data Sheet
1
Dec. 2011
?
Changed ?DVB--T OFDM? to ?DVB--T (8k OFDM)? throughout
?
Fig. 6, CW Output Power versus Input Power: corrected typographical error in dBm to watts conversion
values,p.5
?
Fig. 7, CW Power Gain versus Output Power (Narrowband
Test Circuit): adjusted x--axis scale from 0 to
140 watts to 10 to 150 watts, p. 5
?
Updated Fig. 9, Intermodulation Distortion Products versus Output Power, to correct X--axis PEP power
values,p.6
?
Fig. 10, Intermodulation Distortion Products versus Two--Tone Spacing: added f = 860 MHz to graph
callouts, p. 6
?
Updated Fig. 11, Two--Tone Power Gain versus Output Power, to correct X--axis PEP power values, p. 6
?
Updated Fig. 12, Third Order Intermodulation Distortion versus Output Power, to correct X--axis PEP
power values, p. 6
?
Fig. 18, MTTF versus Junction Temperature -- CW: MTTF end temperature on graph changed to match
maximum operating junction temperature, p. 8
?
Fig. 19, Series Equivalent Source and Load Impedance: removed plot, p. 9
?
Added 470--860 MHz Broadband Reference Circuit frequency table, p. 9
?
Added Fig. 20, 470--860 MHz Broadband 2″×3″Compact Reference Circuit Component Layout, p. 9
?
Added Table 7, 470--860 MHz Broadband 2″×3″Reference Circuit Component Designations and Values,
p. 10
?
Added Fig. 21, Single--Carrier DVB--T (8k OFDM) Power Gain and Drain Efficiency versus Frequency
(Broadband Reference Circuit), p. 11
?
Added Fig. 22, Single--Carrier DVB--T (8k OFDM) Output PAR and IMD Shoulder versus Frequency
(Broadband Reference Circuit), p. 11
?
Added Fig. 23, Pulsed Power Gain and Drain Efficiency versus Output Power (Broadband Reference
Circuit),p.11
相关PDF资料
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