- 您现在的位置：买卖IC网 > PDF目录96086 > MSD1819A-RT3 (ON SEMICONDUCTOR) 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR PDF资料下载
参数资料
| 型号： | MSD1819A-RT3 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 小信号晶体管 |
| 英文描述： | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR |
| 封装： | CASE 419-04, SC-70, 3 PIN |
| 文件页数： | 5/5页 |
| 文件大小： | 153K |
| 代理商： | MSD1819A-RT3 |
MSD1819ART1
http://onsemi.com
1377
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
HEATING
ZONES 3 & 6
SOAK"
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6
VENT
STEP 7
COOLING
200°C
150°C
100°C
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205° TO 219°C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
100°C
150°C
160°C
140°C
Figure 8. Typical Solder Heating Profile
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
170°C
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177 189
°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
相关PDF资料 |
PDF描述 |
|---|---|
| MSD42T1G | 150 mA, 300 V, NPN, Si, SMALL SIGNAL TRANSISTOR |
| MSD52-16 | 3 PHASE, 1600 V, SILICON, BRIDGE RECTIFIER DIODE |
| MSD52-16 | 3 PHASE, 1600 V, SILICON, BRIDGE RECTIFIER DIODE |
| MSD601-RT3 | 100 mA, 25 V, NPN, Si, SMALL SIGNAL TRANSISTOR |
| MSD601-ST3 | 100 mA, 25 V, NPN, Si, SMALL SIGNAL TRANSISTOR |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MSD1819A-ST1 | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:NPN GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNT |
| MSD-1G | 制造商:JVC Worldwide 功能描述:1G MICRO SDCARD |
| MSD-1G-NP | 制造商:JVC Worldwide 功能描述:1G MICRO SDCARD |
| MSD200 | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:Glass Passivated Three Phase Rectifier Bridge |
| MSD200-08 | 功能描述:DIODE BRIDGE 3PH 800V 200A SM3 RoHS:是 类别:半导体模块 >> 桥式整流器 系列:- 标准包装:10 系列:- 电压 - 峰值反向(最大):1000V 电流 - DC 正向(If):35A 二极管类型:单相 速度:标准恢复 >500ns，> 200mA（Io） 反向恢复时间(trr):- 安装类型:底座安装 封装/外壳:ISOTOP 包装:托盘 供应商设备封装:ISOTOP? |
发布紧急采购，3分钟左右您将得到回复。