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参数资料
| 型号： | MT29C2G24MAKLACG-75IT |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA152 |
| 封装： | GREEN, VFBGA-152 |
| 文件页数： | 7/15页 |
| 文件大小： | 421K |
| 代理商： | MT29C2G24MAKLACG-75IT |
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
Micron Technology, Inc., reserves the right to change products or specifications without notice.
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
15
2008 Micron Technology, Inc. All rights reserved.
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Revision History
Preliminary
Revision History
Rev. E, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4/09
“NAND Flash-Specific Features” on page 1: Deleted device size bullet.
Figure 2: “152-Ball Part Number Chart,” on page 2: Added U and V options under
NAND Flash configurations; deleted low-power option under LPDRAM self refresh
current; added dimensions to package codes; added CS# to first column under chip
count; changed CE# from 2 to 1 for B and D under chip count.
Table 1, “Production Part Numbers,” on page 3: Replaced former table 1.
Updated figure.
Updated figure.
Table 2, “x8/x16 NAND Ball Descriptions,” on page 7: Updated table.
Table 3, “x16/x32 LPDDR Ball Descriptions,” on page 8: Updated table.
Table 4, “Non-Device-Specific Ball Descriptions,” on page 8: Updated table.
Table 5, “Absolute Maximum Ratings,” on page 9: Updated table.
Table 6, “Recommended Operating Conditions,” on page 9: Updated table.
figure title; updated figure.
ure.
Rev. D, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11/08
Updated template; ready for external publication.
Rev. C, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8/08
Added part number for JQ package code, page 1.
Figure 2, Marketing Part Number Example, on page 2: added JQ package code.
Added JQ package diagram, Figure 9, 152-Ball TFBGA (Package Code: JQ), on page 14.
Rev. B, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4/08
On page 1, added part number for CA package code.
Figure 2: Marketing Part Number Example on page 2: Added CA package code.
Removed former capacitance tables. See component data sheets for capacitance.
VFBGA (Package Code: CG) on page 13: Updated figures.
Rev. A, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2/08
Initial release.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MT29C2G24MAKLAJA- 0 | 制造商:Micron Technology Inc 功能描述:128MX16/32MX32 MCP PLASTIC 1.8V COMBO - Trays |
| MT29C2G24MAKLAJA-6 IT | 制造商:Micron Technology Inc 功能描述:Combo Mem 128Mx16 Flash + 64Mx16 LPSDRAM 1.8V 168-Pin VFBGA Tray |
| MT29C2G24MAKLAJF-6 IT | 制造商:Micron Technology Inc 功能描述:128MX16/32MX32 MCP PLASTIC IND TEMP STACKED GREEN VFBGA 1.8V - Trays |
| MT29C2G24MAKLAJF-6 IT TR | 制造商:Micron Technology Inc 功能描述:128MX16/32MX32 MCP PLASTIC IND TEMP STACKED GREEN VFBGA 1.8V - Tape and Reel |
| MT29C2G24MAKLAJG-6 IT | 制造商:Micron Technology Inc 功能描述:Combo Mem 128Mx16 Flash + 32Mx32 LPSDRAM 1.8V 168-Pin VFBGA Tray 制造商:Micron Technology Inc 功能描述:128MX16/32MX32 MCP PLASTIC IND TEMP STACKED GREEN VFBGA 1.8V - Trays |
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