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参数资料
型号： NAND08GR4B2BZC6T
厂商： STMICROELECTRONICS
元件分类： PROM
英文描述： 512M X 16 FLASH 1.8V PROM, 35 ns, PBGA63
封装： 9.50 X 12 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, LFBGA-63
文件页数： 20/59页
文件大小： 998K
代理商： NAND08GR4B2BZC6T
27/59
NAND512-B, NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
Block Erase
Erase operations are done one block at a time. An
erase operation sets all of the bits in the ad-
dressed block to ‘1’. All previous data in the block
is lost.
An erase operation consists of three steps (refer to
Figure 17.):
1.
One bus cycle is required to setup the Block
Erase command. Only addresses A18-A27
(x8) or A17-A26 (x16) are used, the other
address inputs are ignored.
2.
two or three bus cycles are then required to
load the address of the block to be erased.
Refer to Table 8. and Table 9. for the block
addresses of each device.
3.
one bus cycle is required to issue the Block
Erase confirm command to start the P/E/R
Controller.
The operation is initiated on the rising edge of
write Enable, W, after the confirm command is is-
sued. The P/E/R Controller handles Block Erase
and implements the verify process.
During the Block Erase operation, only the Read
Status Register and Reset commands will be ac-
cepted, all other commands will be ignored.
Once the program operation has completed the P/
E/R Controller bit SR6 is set to ‘1’ and the Ready/
Busy signal goes High. If the operation completed
successfully, the Write Status Bit SR0 is ‘0’, other-
wise it is set to ‘1’.
Figure 17. Block Erase Operation
Reset
The Reset command is used to reset the Com-
mand Interface and Status Register. If the Reset
command is issued during any operation, the op-
eration will be aborted. If it was a program or erase
operation that was aborted, the contents of the
memory locations being modified will no longer be
valid as the data will be partially programmed or
erased.
If the device has already been reset then the new
Reset command will not be accepted.
The Ready/Busy signal goes Low for tBLBH4 after
the Reset command is issued. The value of tBLBH4
depends on the operation that the device was per-
forming when the command was issued, refer to
Table 25. for the values.
I/O
RB
Block Address
Inputs
SR0
ai07593
D0h
70h
60h
Block Erase
Setup Code
Confirm
Code
Read Status Register
Busy
tBLBH3
(Erase Busy time)
相关PDF资料
PDF描述
NAND08GR4B3BN1 512M X 16 FLASH 1.8V PROM, 35 ns, PDSO48
NAND512R3B3BZA6E 64M X 8 FLASH 1.8V PROM, 35 ns, PBGA63
NAND512W3B3BN6E 64M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND512W3B3BZA6E 64M X 8 FLASH 3V PROM, 35 ns, PBGA63
NAND512W3B3AN1 64M X 8 FLASH 3V PROM, 35 ns, PDSO48
相关代理商/技术参数
参数描述
NAND08GW3B2AN6E 功能描述:闪存 4 GBit 2112 Byte 1056 WP 1.8v/3v RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
NAND08GW3B2AN6F 功能描述:闪存 4 GB 2112B 1056 Word Pg 1.8V/3V RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
NAND08GW3B2BN6E 制造商:Micron Technology Inc 功能描述:NAND & S.MEDIA FLASH - Trays
NAND08GW3B2CN6E 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
NAND08GW3B2CN6F 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
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