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参数资料
| 型号： | NCP1654PFCGEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 2/23页 |
| 文件大小： | 228K |
| 描述： | EVAL BOARD FOR NCP1654PFCG |
| 设计资源： | NCP1654EVB BOM NCP1654EVB Gerber Files NCP1654EVB Schematic |
| 标准包装： | 1 |
| 主要目的： | AC/DC，次级 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 378 ~ 401 V |
| 输入电压： | 85 ~ 230 VAC，15VDC |
| 稳压器拓扑结构： | 升压 |
| 频率 - 开关： | 65kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | NCP1654 |
| 其它名称： | NCP1654PFCGEVBOS |
NCP1654
http://onsemi.com
2
MAXIMUM RATINGS TABLE
Symbol
Pin
Rating
Value
Unit
DRV
8
Output Drive Capability Source
Output Drive Capability Sink
1.5
+1.5
A
V
CC
7
Power Supply Voltage, V
CC
pin, continuous voltage
0.3, +20
V
7
Transient Power Supply Voltage, duration < 10 ms, IV
CC
< 10 mA
+25
V
Vin
2, 3, 4, 5, 6
Input Voltage
0.3, +10
V
P
D
(SO)
R
q
JA
(SO)
Power Dissipation and Thermal Characteristics
D suffix, Plastic Package, Case 751
Maximum Power Dissipation @ T
A
= 70癈
Thermal Resistance JunctiontoAir
450
178
mW
癈/W
T
J
Operating Junction Temperature Range
40 to +125
癈
T
Jmax
Maximum Junction Temperature
150
癈
T
Smax
Storage Temperature Range
65 to +150
癈
T
Lmax
Lead Temperature (Soldering, 10 s)
300
癈
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) 2000 V per JEDEC standard JESD22, Method A114E
Machine Model (MM) 200 V (except pin#7 which complies 150 V) per JEDEC standard JESD22, Method A115A.
2. This device contains Latchup Protection and exceeds ?00 mA per JEDEC Standard JESD78.
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