参数资料
型号: NCP3101BUCK2GEVB
厂商: ON Semiconductor
文件页数: 4/26页
文件大小: 0K
描述: EVAL BOARD FOR NCP3101BUCK2G
设计资源: NCP3101BUCK2 EVB BOM
NCP3101BUCK2GEVB Gerber Files
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 1,非隔离
输出电压: 1.5V
电流 - 输出: 6A
输入电压: 5V
稳压器拓扑结构: 降压
板类型: 完全填充
已供物品:
已用 IC / 零件: NCP3101
其它名称: NCP3101BUCK2GEVBOS
NCP3101C
Table 2. ABSOLUTE MAXIMUM RATINGS
Pin Name
Bootstrap Pin Voltage vs V PWRPHS
High Side Switch Max DC Current
V PWRPHS Pin Voltage
V PWRPHS Pin Voltage (spikes < 50 ns)
CPHASE Pin Voltage
CPHASE Pin Voltage (spikes < 50 ns)
Current Limit Set and Bottom Gate
Current Limit Set and Bottom Gate (spikes < 200 ns)
Top Gate vs Ground
Top Gate vs Phase
Top Gate vs Phase (spikes < 200 ns)
FB Pin Voltage
COMP/DISABLE
Rating
Thermal Resistance, Junction ? to ? Ambient (Note 2)
Thermal Resistance, Junction ? to ? Case (Note 2) at
85 ° C
Continuous Power Distribution (T A = +85 ° C)
Storage Temperature Range
Junction Operating Temperature
Lead Temperature Soldering (10 sec):
Reflow (SMD styles only) Pb ? Free (Note 1)
Symbol
V BST ? V PWRPHS
I PHS
V PWRPHS
V PWRPHSSP
V CPHS
V CPHSTR
V BG
V BGSP
V TG
V TG
V TGSP
V FB
VCOMP/DIS
Symbol
R q JA
R q JC
P D
T stg
T J
RF
Min
? 0.3
0
? 0.7
? 5
? 0.7
? 5
? 0.3
? 2.0
? 0.3
? 0.3
? 2.0
? 0.3
? 0.3
Max
15
7.5
30
40
30
40
V CC < V BG < 15
V CC < V BGSP < 15
30
V CC < V TG < 15
V CC < V TGSP < 15
V CC < V FB < 6.0
V CC < V COMP/DIS < 6.0
Symbol
35
5
1.8
? 55 to 150
? 40 to 150
260 peak
Unit
V
A
V
V
V
V
V
V
V
V
V
V
V
Unit
° C/W
° C/W
W
° C
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: These devices have limited built ? in ESD protection. The devices should be shorted together or the device placed in conductive
foam during storage or handling to prevent electrostatic damage to the device.
1. 60 ? 180 seconds minimum above 237 ° C
2. Based on 110 * 100 mm double layer PCB with 35 m m thick copper plating.
http://onsemi.com
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