参数资料
型号: NTD5414NT4G
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET N-CH 60V 24A DPAK
标准包装: 2,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 24A
开态Rds(最大)@ Id, Vgs @ 25° C: 37 毫欧 @ 24A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 48nC @ 10V
输入电容 (Ciss) @ Vds: 1200pF @ 25V
功率 - 最大: 55W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
NTD5414N, NVD5414N
Power MOSFET
24 Amps, 60 Volts Single N ? Channel
DPAK
Features
? Low R DS(on)
? High Current Capability
? Avalanche Energy Specified
? AEC Q101 Qualified ? NVD5414N
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? LED Lighting and LED Backlight Drivers
? DC ? DC Converters
? DC Motor Drivers
? Power Supplies Secondary Side Synchronous Rectification
V (BR)DSS
60 V
http://onsemi.com
R DS(ON) MAX
37 m W @ 10 V
N ? Channel
D
G
I D MAX
(Note 1)
24 A
MAXIMUM RATINGS (T J = 25 ° C Unless otherwise specified)
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
60
Unit
V
S
1
3
Gate
Source
Gate ? to ? Source Voltage ? Continuous
Gate ? to ? Source Voltage ? Nonrepetitive
(T P < 10 m s)
Continuous Drain Steady T C = 25 ° C
Current R q JC State
(Note 1) T C = 100 ° C
Power Dissipation Steady T C = 25 ° C
R q JC (Note 1) State
Pulsed Drain Current t p = 10 m s
Operating and Storage Temperature Range
V GS
V GS
I D
P D
I DM
T J , T stg
$ 20
$ 30
24
16
55
75
? 55 to
+175
V
V
A
W
A
° C
1 2
3
4
DPAK
CASE 369AA
STYLE 2
MARKING
DIAGRAMS
4
Drain
2
Drain
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 50 V dc , V GS = 10 V, I L(pk) = 24 A,
L = 0.3 mH, R G = 25 W )
I S
E AS
24
86.4
A
mJ
5414N
Y
WW
G
= Device Code
= Year
= Work Week
= Pb ? Free Device
Lead Temperature for Soldering
Purposes, 1/8 ″ from Case for 10 Seconds
T L
260
° C
ORDERING INFORMATION
THERMAL RESISTANCE RATINGS
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Parameter
Junction ? to ? Case (Drain) Steady State
(Note 1)
Symbol
R q JC
R q JA
Max
2.7
58.6
Unit
° C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [1 oz] including traces).
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 1
1
Publication Order Number:
NTD5414N/D
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