参数资料
型号: NTD5807NT4G
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 40V 23A DPAK
标准包装: 2,500
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 40V
电流 - 连续漏极(Id) @ 25° C: 23A
开态Rds(最大)@ Id, Vgs @ 25° C: 31 毫欧 @ 5A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 20nC @ 10V
输入电容 (Ciss) @ Vds: 603pF @ 25V
功率 - 最大: 33W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
NTD5807N, NVD5807N
Power MOSFET
40 V, 23 A, Single N ? Channel, DPAK/IPAK
Features
? Low R DS(on)
? High Current Capability
? Avalanche Energy Specified
? AEC ? Q101 Qualified and PPAP Capable ? NVD5807N
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? CCFL Backlight
? DC Motor Control
? Class D Amplifier
? Power Supply Secondary Side Synchronous Rectification
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
40 V
G
http://onsemi.com
R DS(on) MAX
37 m W @ 4.5 V
31 m W @ 10 V
D
I D MAX
16 A
23 A
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Gate ? to ? Source Voltage
? Non ? Repetitive (t p < 10 m S)
V DSS
V GS
V GS
40
" 20
" 30
V
V
V
S
N ? CHANNEL MOSFET
4
4
Current (R q JC )
3
CASE 369AA
(Surface Mount)
STYLE 2
Continuous Drain T C = 25 ° C
(Note 1) Steady T C = 100 ° C
State
Power Dissipation T C = 25 ° C
(R q JC ) (Note 1)
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
I D
P D
I DM
T J , T stg
I S
23
16
33
45
? 55 to
175
23
A
W
A
° C
A
1 2
3 1
2
DPAK
IPAK
CASE 369D
(Straight Lead
DPAK)
MARKING DIAGRAMS
& PIN ASSIGNMENT
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 50 V, V GS = 10 V, R G = 25 W ,
I L(pk) = 14 A, L = 0.3 mH, V DS = 40 V)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
E AS
T L
29.4
260
mJ
° C
4
Drain
4
Drain
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
2
1 Drain 3
Gate Source
1 2 3
Gate Drain Source
Junction ? to ? Case (Drain) R q JC 4.5 ° C/W
Junction ? to ? Ambient ? Steady State (Note 1) R q JA 107
1. Surface ? mounted on FR4 board using the minimum recommended pad size.
Y
WW
5807N
G
= Year
= Work Week
= Device Code
= Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 4
1
Publication Order Number:
NTD5807N/D
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