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| 型号： | NTLGF3402PT2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 1/8页 |
| 文件大小： | 0K |
| 描述： | MOSFET P-CH 20V 2.3A 6-DFN |
| 标准包装： | 3,000 |
| 系列： | FETKY™ |
| FET 型： | MOSFET P 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 20V |
| 电流 - 连续漏极(Id) @ 25° C： | 2.3A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 140 毫欧 @ 2.7A，4.5V |
| Id 时的 Vgs(th)（最大）： | 2V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 10nC @ 4.5V |
| 输入电容 (Ciss) @ Vds： | 350pF @ 10V |
| 功率 - 最大： | 1.14W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-VDFN 裸露焊盘 |
| 供应商设备封装： | 6-DFN（3x3） |
| 包装： | 带卷 (TR) |
NTLGF3402P
Power MOSFET and
Schottky Diode
?20 V, ?3.9 A FETKY ) , P?Channel,
2.0 A Schottky Barrier Diode, DFN6
http://onsemi.com
Features
? Flat Lead 6 Terminal Package 3x3x1 mm
? Enhanced Thermal Characteristics
? Low V F and Low Leakage Schottky Diode
? Reduced Gate Charge to Improve Switching Response
? This is a Pb?Free Device
Applications
V (BR)DSS
?20 V
V R MAX
MOSFET
R DS(on) TYP
110 m W @ ?4.5 V
SCHOTTKY DIODE
V F TYP
I D MAX
?3.9 A
I F MAX
? Buck Converter
? High Side DC?DC Conversion Circuits
? Power Management in Portable, HDD and Computing
20 V
2
5
0.36 V
1
2
2.0 A
3
MOSFET MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Symbol
Value
Unit
3
Drain?to?Source Voltage
Gate?to?Source Voltage
V DSS
V GS
?20
± 12
V
V
4
6
5
4
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
t ≤ 10 s
Steady
State
t ≤ 10 s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
I D
P D
?2.7
?2.0
?3.9
1.6
3.0
A
W
Heatsink
1
6
1, 6
2, 5
3
4
= Anode
= Source
= Gate
= Drain/Cathode
MARKING
DIAGRAMS
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
?2.3
?1.7
1.14
A
W
1
DFN6
CASE 506AH
1
3402
AYWW
G
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
I DM
T J , T STG
I S
11
?55 to
150
1.1
A
° C
A
3402
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb?Free Package
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T L
260
° C
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
(Cu area = 0.5 in sq).
Device
NTLGF3402PT1G
NTLGF3402PT2G
Package
DFN6
(Pb?Free)
DFN6
(Pb?Free)
Shipping ?
3000 / Tape & Reel
3000 / Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2006
March, 2006 ? Rev. 1
1
Publication Order Number:
NTLGF3402P/D
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