参数资料
型号: NTMFS4701NT3G
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: MOSFET N-CH 12.3A 30V SO8 FL
产品变化通告: Product Discontinuation 09/Jan/2008
标准包装: 5,000
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 7.7A
开态Rds(最大)@ Id, Vgs @ 25° C: 8 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 15nC @ 4.5V
输入电容 (Ciss) @ Vds: 1280pF @ 24V
功率 - 最大: 900mW
安装类型: 表面贴装
封装/外壳: 8-TDFN 裸露焊盘(5 引线)
供应商设备封装: 6-DFN,8-SO 扁平引线(5x6)
包装: 带卷 (TR)
NTMFS4701N
Power MOSFET
30 V, 20 A, Single N ? Channel,
SOIC ? 8 Flat Lead Package
Features
? Thermally and Electrically Enhanced Packaging Compatible with
Standard SOIC ? 8
? New Package Provides Capability of Inspection and Probe After
Board Mounting
? Ultra Low R DS(on) (at 4.5 V GS ), Low Gate Resistance and Low Q G
? Optimized for High Side Control Applications
? High Speed Switching Capability
? These are Pb ? Free Devices
Applications
? Notebook Computer VCORE Applications
? Network Applications
? DC ? DC Converters
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
30 V
http://onsemi.com
R DS(on) Typ
6.0 m W @ 10 V
8.0 m W @ 4.5 V
N ? Channel
D
G
I D Max
20 A
Rating
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
S
S D
4701N
S
AYWZZ
S
G
D
D
Gate ? to ? Source Voltage
Continuous Drain Current
(Note 1 )
Power Dissipation
(Note 1)
Continuous Drain Current
(Note 2)
Power Dissipation
(Note 2)
Steady
State
t v 10 s
Steady
State
t v 10 s
Steady
State
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
V GS
I D
I D
P D
P D
I D
P D
$ 20
12.3
9.8
20
2.3
6.0
7.7
6.2
0.9
V
A
W
A
W
1
SOIC ? 8 FLAT LEAD
CASE 488AA
STYLE 1
4701N = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
MARKING DIAGRAM &
PIN ASSIGNMENT
D
Pulsed Drain Current t p = 10 m s
Operating and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(V DD = 25 V, V GS = 10 V, I PK = 7.5 A,
L = 10 mH, R G = 25 W )
I DM
T J , T stg
I S
E AS
60
? 55 to
150
6.0
280
A
° C
A
mJ
ORDERING INFORMATION
Device Package Shipping ?
NTMFS4701NT1G SOIC ? 8 FL 1500 / Tape & Reel
(Pb ? Free)
NTMFS4701NT3G SOIC ? 8 FL 5000 / Tape & Reel
(Pb ? Free)
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 in from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 in sq. pad size
(Cu area 1.127 in sq. [1 oz} including traces).
2. Surface ? mounted on FR4 board using minimum recommended pad size
(Cu area 0.412 in sq.).
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 4
1
Publication Order Number:
NTMFS4701N/D
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