参数资料
型号: NTMS4177PR2G
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: MOSFET P-CH 30V 6.6A 8-SOIC
产品变化通告: Wire Change 12/May/2009
标准包装: 2,500
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 6.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 12 毫欧 @ 11.4A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 29nC @ 4.5V
输入电容 (Ciss) @ Vds: 3100pF @ 24V
功率 - 最大: 840mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
NTMS4177P
Power MOSFET
-30 V, -11.4 A, P-Channel, SOIC-8
Features
?
?
?
?
?
Low R DS(on ) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
SOIC-8 Surface Mount Package Saves Board Space
This is a Pb-Free Device
V (BR)DSS
-30 V
http://onsemi.com
R DS(on) Max
12 m W @ -10 V
I D Max
-11.4 A
Applications
? Load Switches
? Notebook PC's
? Desktop PC's
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
19 m W @ -4.5 V
P-Channel
D
Rating
Drain-to-Source Voltage
Symbol
V DSS
Value
-30
Unit
V
Gate-to-Source Voltage
V GS
± 20
V
G
Continuous Drain
Current R q JA (Note 1)
Power Dissipation
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
I D
P D
-8.9
-7.1
1.52
A
W
S
R q JA (Note 1)
Continuous Drain
Current R q JA (Note 2)
Steady
T A = 25 ° C
T A = 70 ° C
I D
-6.6
-5.3
A
MARKING DIAGRAM
& PIN ASSIGNMENT
Power Dissipation
R q JA (Note 2)
State
T A = 25 ° C
P D
0.84
W
8
D D D D
Continuous Drain
Current R q JA t < 10 s
(Note 1)
Power Dissipation
R q JA t < 10 s (Note 1)
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
I D
P D
-11.4
-9.3
2.5
A
W
8
1
SOIC-8
CASE 751
STYLE 12
1
4177P
AYWW
G
S S S G
Pulsed Drain Current
T A = 25 ° C,
t p = 10 m s
I DM
-46
A
4177P
A
Y
= Device Code
= Assembly Location
= Year
Operating Junction and Storage Temperature
T J , T STG
-55 to
° C
WW
= Work Week
+150
G
= Pb-Free Package
Source Current (Body Diode)
I S
-2.1
A
Single Pulse Drain-to-Source Avalanche
Energy T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 20 A pk , L = 1.0 mH, R G = 25 W
EAS
200
mJ
ORDERING INFORMATION
Device Package Shipping ?
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 ″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
NTMS4177PR2G
SOIC-8
(Pb-Free)
2500/Tape & Reel
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 inch sq pad size, 1 oz Cu.
2. Surface-mounted on FR4 board using the minimum recommended pad size.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 0
1
Publication Order Number:
NTMS4177P/D
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