参数资料
型号: NTMSD3P303R2G
厂商: ON Semiconductor
文件页数: 2/9页
文件大小: 0K
描述: MOSFET P-CH 30V 2.34A 8-SOIC
产品变化通告: Product Obsolescence 13/Apr/2009
标准包装: 2,500
系列: FETKY™
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 二极管(隔离式)
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 2.34A
开态Rds(最大)@ Id, Vgs @ 25° C: 85 毫欧 @ 3.05A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 25nC @ 10V
输入电容 (Ciss) @ Vds: 750pF @ 24V
功率 - 最大: 730mW
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
其它名称: NTMSD3P303R2GOS
NTMSD3P303R2
SCHOTTKY MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating
Peak Repetitive Reverse Voltage
DC Blocking Voltage
Thermal Resistance ? Junction ? to ? Ambient (Note 5)
Thermal Resistance ? Junction ? to ? Ambient (Note 6)
Thermal Resistance ? Junction ? to ? Ambient (Note 7)
Average Forward Current (Note 7)
(Rated V R , T A = 100 ° C)
Peak Repetitive Forward Current (Note 7)
(Rated V R , Square Wave, 20 kHz, T A = 105 ° C)
Non ? Repetitive Peak Surge Current (Note 7)
(Surge Applied at Rated Load Conditions, Half ? Wave, Single Phase, 60 Hz)
Symbol
V RRM
V R
R q JA
R q JA
R q JA
I O
I FRM
I FSM
Value
30
197
97
62.5
3.0
6.0
30
Unit
V
° C/W
° C/W
° C/W
A
A
A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
5. Minimum FR ? 4 or G ? 10 PCB, Steady State.
6. Mounted onto a 2 ″ square FR ? 4 Board (1 in sq, 2 oz Cu 0.06 ″ thick single sided), Steady State.
7. Mounted onto a 2 ″ square FR ? 4 Board (1 in sq, 2 oz Cu 0.06 ″ thick single sided), t ≤ 10 seconds.
ELECTRICAL CHARACTERISTICS (T J = 25 ° C unless otherwise noted) (No te 8)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain ? to ? Source Breakdown Voltage
(V GS = 0 Vdc, I D = ? 250 m Adc)
Temperature Coefficient (Positive)
Zero Gate Voltage Drain Current
(V DS = ? 30 Vdc, V GS = 0 Vdc, T J = 25 ° C)
(V DS = ? 30 Vdc, V GS = 0 Vdc, T J = 125 ° C)
Gate ? Body Leakage Current
(V GS = ? 20 Vdc, V DS = 0 Vdc)
Gate ? Body Leakage Current
(V GS = +20 Vdc, V DS = 0 Vdc)
V (BR)DSS
I DSS
I GSS
I GSS
? 30
?
?
?
?
?
?
? 30
?
?
?
?
?
?
? 1.0
? 25
? 100
100
Vdc
mV/ ° C
m Adc
nAdc
nAdc
ON CHARACTERISTICS
Gate Threshold Voltage
(V DS = V GS , I D = ? 250 m Adc)
Temperature Coefficient (Negative)
Static Drain ? to ? Source On ? State Resistance
(V GS = ? 10 Vdc, I D = ? 3.05 Adc)
(V GS = ? 4.5 Vdc, I D = ? 1.5 Adc)
Forward Transconductance
(V DS = ? 15 Vdc, I D = ? 3.05 Adc)
V GS(th)
R DS(on)
g FS
? 1.0
?
?
?
?
? 1.7
3.6
0.063
0.090
5.0
? 2.5
?
0.085
0.125
?
Vdc
W
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
(V DS = ? 24 Vdc,
V GS = 0 Vdc,
f = 1.0 MHz)
C iss
C oss
C rss
?
?
?
520
170
70
750
325
135
pF
8. Handling precautions to protect against electrostatic discharge are mandatory.
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