参数资料
型号: NTR2101PT1G
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET P-CH 8V 3.7A SOT-23
产品变化通告: Wire Change for SOT23 Pkg 26/May/2009
产品目录绘图: MOSFET SOT-23-3 Pkg
标准包装: 10
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 8V
电流 - 连续漏极(Id) @ 25° C: 3.7A
开态Rds(最大)@ Id, Vgs @ 25° C: 52 毫欧 @ 3.5A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 15nC @ 4.5V
输入电容 (Ciss) @ Vds: 1173pF @ 4V
功率 - 最大: 960mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23-3(TO-236)
包装: 标准包装
产品目录页面: 1558 (CN2011-ZH PDF)
其它名称: NTR2101PT1GOSDKR
NTR2101P
Small Signal MOSFET
? 8.0 V, ? 3.7 A, Single P ? Channel, SOT ? 23
Features
?
?
?
?
Leading Trench Technology for Low R DS(on)
? 1.8 V Rated for Low Voltage Gate Drive
SOT ? 23 Surface Mount for Small Footprint (3 x 3 mm)
This is a Pb ? Free Device
V (BR)DSS
http://onsemi.com
R DS(on) Typ
39 m W @ ? 4.5 V
I D Max
Applications
? High Side Load Switch
? DC ? DC Conversion
? Cell Phone, Notebook, PDAs, etc.
? 8.0 V
52 m W @ ? 2.5 V
79 m W @ ? 1.8 V
P ? Channel
D
? 3.7 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
? 8.0
± 8.0
V
V
G
Continuous Drain
Current (Note 1)
t ≤ 5s
T A = 25 ° C
T A = 70 ° C
I D
? 3.7
? 3.0
A
S
Power Dissipation
(Note 1)
t ≤ 5s
P D
0.96
W
3
MARKING DIAGRAM &
PIN ASSIGNMENT
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
I DM
T J ,
T STG
I S
? 11
? 55 to
150
? 1.2
A
° C
A
1
2
SOT ? 23
Drain
3
TR7 M G
G
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T L
260
° C
CASE 318
STYLE 21
1
Gate
2
Source
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
Unit
TR7 = Specific Device Code
M = Date Code*
Junction ? to ? Ambient – Steady State R q JA 160 ° C/W
Junction ? to ? Ambient ? t ≤ 5 s R q JA 130
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
G = Pb ? Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device Package Shipping ?
NTR2101PT1G
SOT ? 23
3000/Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2013
January, 2013 ? Rev. 6
1
Publication Order Number:
NTR2101P/D
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