参数资料
型号: NTTD1P02R2G
厂商: ON Semiconductor
文件页数: 4/6页
文件大小: 0K
描述: MOSFET P-CHAN DUAL 20V 8MICRO
产品变化通告: Product Obsolescence 06/Oct/2006
标准包装: 4,000
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 1.45A
开态Rds(最大)@ Id, Vgs @ 25° C: 160 毫欧 @ 1.45A,4.5V
Id 时的 Vgs(th)(最大): 1.4V @ 250µA
闸电荷(Qg) @ Vgs: 10nC @ 4.5V
输入电容 (Ciss) @ Vds: 265pF @ 16V
功率 - 最大: 500mW
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: Micro8?
包装: 带卷 (TR)
其它名称: NTTD1P02R2GOS
NTTD1P02R2
800
600
C iss
C rss
V DS = 0 V
V GS = 0 V
T J = 25 ° C
5
4
3
QT
? V GS
20
18
16
14
12
400
Q1
Q2
10
200
0
10
5
0
5
10
15
C iss
C oss
C rss
20
2
1
0
0
1
2
? V DS
3
4
I D = ? 1.45 A
T J = 25 ° C
5
6
8
6
4
2
0
100
? V GS ? V DS
GATE ? TO ? SOURCE OR DRAIN ? TO ? SOURCE
VOLTAGE (VOLTS)
Figure 7. Capacitance Variation
Q g , TOTAL GATE CHARGE (nC)
Figure 8. Gate ? to ? Source and
Drain ? to ? Source Voltage versus Total Charge
V DD = ? 16 V
I D = ? 1.45 A
V GS = ? 4.5 V
1.6
1.2
V GS = 0 V
T J = 25 ° C
10
t r
t d (off)
t f
t d (on)
0.8
0.4
1
1
10
100
0
0.4
0.5
0.6
0.7
0.8
0.9
1
R G, GATE RESISTANCE (OHMS)
Figure 9. Resistive Switching Time Variation
versus Gate Resistance
? V SD, SOURCE ? TO ? DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage
versus Current
100
10
1
V GS = 8 V
SINGLE PULSE
T C = 25 ° C
100 m s
1 ms
10 ms
I S
di/dt
t a
t rr
t b
TIME
t p
0.25 I S
0.1
0.01
0.1
R DS(on) LIMIT
THERMAL LIMIT dc
PACKAGE LIMIT
1 10
V DS , DRAIN ? TO ? SOURCE VOLTAGE (VOLTS)
100
I S
Figure 12. Diode Reverse Recovery Waveform
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
http://onsemi.com
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