参数资料
型号: NTTS2P02R2
厂商: ON Semiconductor
文件页数: 2/6页
文件大小: 0K
描述: MOSFET P-CH 20V 2.4A 8MICRO
产品变化通告: Product Obsolescence 11/Feb/2009
标准包装: 4,000
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.4A
开态Rds(最大)@ Id, Vgs @ 25° C: 90 毫欧 @ 2.4A,4.5V
Id 时的 Vgs(th)(最大): 1.4V @ 250µA
闸电荷(Qg) @ Vgs: 18nC @ 4.5V
输入电容 (Ciss) @ Vds: 550pF @ 16V
功率 - 最大: 780mW
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: Micro8?
包装: 带卷 (TR)
其它名称: NTTS2P02R2OS
NTTS2P02R2
ELECTRICAL CHARACTERISTICS (T C = 25 ° C unless otherwise noted) (N ote 4)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain ? to ? Source Breakdown Voltage
(V GS = 0 Vdc, I D = ? 250 m Adc)
Temperature Coefficient (Positive)
Zero Gate Voltage Drain Current
(V GS = 0 Vdc, V DS = ? 16 Vdc, T J = 25 ° C)
(V GS = 0 Vdc, V DS = ? 16 Vdc, T J = 125 ° C)
Zero Gate Voltage Drain Current
(V GS = 0 Vdc, V DS = ? 20 Vdc, T J = 25 ° C)
Gate ? Body Leakage Current
(V GS = ? 8 Vdc, V DS = 0 Vdc)
Gate ? Body Leakage Current
(V GS = +8 Vdc, V DS = 0 Vdc)
V (BR)DSS
I DSS
I DSS
I GSS
I GSS
? 20
?
?
?
?
?
?
?
? 12.7
?
?
?
?
?
?
?
? 1.0
? 25
? 5.0
? 100
100
Vdc
mV/ ° C
m Adc
m Adc
nAdc
nAdc
ON CHARACTERISTICS
Gate Threshold Voltage
(V DS = V GS , I D = ? 250 m Adc)
Temperature Coefficient (Negative)
Static Drain ? to ? Source On ? State Resistance
(V GS = ? 4.5 Vdc, I D = ? 2.4 Adc)
(V GS = ? 2.7 Vdc, I D = ? 1.2 Adc)
(V GS = ? 2.5 Vdc, I D = ? 1.2 Adc)
Forward Transconductance (V DS = ? 10 Vdc, I D = ? 1.2 Adc)
V GS(th)
R DS(on)
g FS
? 0.5
?
?
?
?
2.0
? 0.90
2.5
0.070
0.100
0.110
4.2
? 1.4
?
0.090
0.130
?
?
Vdc
mV/ ° C
W
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
C iss
?
550
?
pF
Output Capacitance
Reverse Transfer Capacitance
(V DS = ? 16 Vdc, V GS = 0 Vdc,
f = 1.0 MHz)
C oss
C rss
?
?
200
100
?
?
SWITCHING CHARACTERISTICS (Notes 5 & 6)
Turn ? On Delay Time
t d(on)
?
10
?
ns
Rise Time
Turn ? Off Delay Time
Fall Time
(V DD = ? 10 Vdc, I D = ? 2.4 Adc,
V GS = ? 4.5 Vdc, R G = 6.0 W )
t r
t d(off)
t f
?
?
?
31
33
29
?
?
?
Turn ? On Delay Time
t d(on)
?
15
?
ns
Rise Time
Turn ? Off Delay Time
Fall Time
(V DD = ? 10 Vdc, I D = ? 1.2 Adc,
V GS = ? 2.7 Vdc, R G = 6.0 W )
t r
t d(off)
t f
?
?
?
40
35
35
?
?
?
Total Gate Charge
Gate ? Source Charge
Gate ? Drain Charge
(V DS = ? 16 Vdc,
V GS = ? 4.5 Vdc,
I D = ? 2.4 Adc)
Q tot
Q gs
Q gd
?
?
?
10
1.5
5.0
18
?
?
nC
BODY ? DRAIN DIODE RATINGS (Note 5)
Diode Forward On ? Voltage
Reverse Recovery Time
Reverse Recovery Stored Charge
(I S = ? 2.4 Adc, V GS = 0 Vdc)
(I S = ? 2.4 Adc, V GS = 0 Vdc, T J = 125 ° C)
(I S = ? 2.4 Adc, V GS = 0 Vdc,
dI S /dt = 100 A/ m s)
V SD
t rr
t a
t b
Q RR
?
?
?
?
?
?
? 0.88
? 0.75
37
16
21
0.025
? 1.0
?
?
?
?
?
Vdc
ns
m C
4. Handling precautions to protect against electrostatic discharge are mandatory.
5. Indicates Pulse Test: Pulse Width = 300 m s max, Duty Cycle = 2%.
6. Switching characteristics are independent of operating junction temperature.
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