参数资料
型号: NVB25P06T4G
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET P-CH 60V 27.5A D2PAK
标准包装: 800
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 27.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 82 毫欧 @ 25A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 50nC @ 10V
输入电容 (Ciss) @ Vds: 1680pF @ 25V
功率 - 最大: 120W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 带卷 (TR)
NTB25P06, NVB25P06
Power MOSFET
? 60 V, ? 27.5 A, P ? Channel D 2 PAK
Designed for low voltage, high speed switching applications and to
withstand high energy in the avalanche and commutation modes.
Features
? AEC Q101 Qualified ? NVB25P06
? These Devices are Pb ? Free and are RoHS Compliant
Typical Applications
? PWM Motor Controls
? Power Supplies
? Converters
? Bridge Circuits
V (BR)DSS
? 60 V
http://onsemi.com
R DS(on) TYP
65 m W @ ? 10 V
P ? Channel
D
I D MAX
? 27.5 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating Symbol
Value
Unit
G
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
? Continuous
? Non ? Repetitive (t p v 10 ms)
V DSS
V GS
V GSM
? 60
" 15
" 20
V
V
Vpk
S
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain Current
? Continuous @ T A = 25 ° C
? Single Pulse (t p v 10 m s)
I D
I DM
27.5
80
A
Apk
Drain
Total Power Dissipation @ T A = 25 ° C
Operating and Storage
Temperature Range
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 25 V, V GS = 10 V,
I L(pk) = 20 A, L = 3 mH, R G = 25 W )
P D
T J , T stg
E AS
120
? 55 to
+175
600
W
° C
mJ
1
2
3
D 2 PAK
CASE 418B
4
Gate
NTB
25P06G
AYWW
Drain
Source
Thermal Resistance
? Junction ? to ? Case
? Junction ? to ? Ambient (Note 1)
? Junction ? to ? Ambient (Note 2)
R q JC
R q JA
R q JA
1.25
46.8
63.2
° C/W
A
Y
WW
G
= Assembly Location
= Year
= Work Week
= Pb ? Free Package
Maximum Lead Temperature for Soldering
Purposes, (1/8 ″ from case for 10 s)
T L
260
° C
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1 ″ pad size
(Cu Area 1.127 in 2 ).
2. When surface mounted to an FR4 board using the minimum recommended
pad size (Cu Area 0.412 in 2 ).
Device
NTB25P06T4G
NVB25P06T4G
Package
D 2 PAK
(Pb ? Free)
D 2 PAK
(Pb ? Free)
Shipping ?
800 / Tape & Reel
800 / Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 4
1
Publication Order Number:
NTB25P06/D
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