参数资料
型号: PIC10F222-I/OT
厂商: Microchip Technology
文件页数: 31/86页
文件大小: 0K
描述: IC PIC MCU FLASH 512X12 SOT-23-6
标准包装: 3,000
系列: PIC® 10F
核心处理器: PIC
芯体尺寸: 8-位
速度: 8MHz
外围设备: POR,WDT
输入/输出数: 4
程序存储器容量: 768B(512 x 12)
程序存储器类型: 闪存
RAM 容量: 23 x 8
电压 - 电源 (Vcc/Vdd): 2 V ~ 5.5 V
数据转换器: A/D 2x8b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: SOT-23-6
包装: 散装
2007 Microchip Technology Inc.
DS41270E-page 35
PIC10F220/222
TABLE 8-2:
RESET CONDITION FOR SPECIAL REGISTERS
8.3.1
MCLR ENABLE
This Configuration bit, when unprogrammed (left in the
‘1’ state), enables the external MCLR function. When
programmed, the MCLR function is tied to the internal
VDD and the pin is assigned to be a I/O. See Figure 8-1.
FIGURE 8-1:
MCLR SELECT
8.4
Power-on Reset (POR)
The PIC10F220/222 devices incorporate an on-chip
Power-on Reset (POR) circuitry, which provides an
internal chip Reset for most power-up situations.
The on-chip POR circuit holds the chip in Reset until
VDD has reached a high enough level for proper oper-
ation. To take advantage of the internal POR, program
the GP3/MCLR/VPP pin as MCLR and tie through a
resistor to VDD, or program the pin as GP3. An internal
weak pull-up resistor is implemented using a transistor
(refer to Table 10-1 for the pull-up resistor ranges). This
will eliminate external RC components usually needed
to create a Power-on Reset.
When the devices start normal operation (exit the
Reset condition), device operating parameters (volt-
age, frequency, temperature,...) must be met to ensure
operation. If these conditions are not met, the devices
must be held in Reset until the operating parameters
are met.
A simplified block diagram of the on-chip Power-on
Reset circuit is shown in Figure 8-2.
The Power-on Reset circuit and the Device Reset
circuit are closely related. On power-up, the Reset latch
is set and the DRT is reset. The DRT timer begins
counting once it detects MCLR to be high. After the
time-out period, which is typically 1.125 ms, it will reset
the Reset latch and thus end the on-chip Reset signal.
A power-up example where MCLR is held low is shown
in Figure 8-3. VDD is allowed to rise and stabilize before
bringing MCLR high. The chip will actually come out of
Reset TDRT msec after MCLR goes high.
In Figure 8-4, the on-chip Power-on Reset feature is
being used (MCLR and VDD are tied together or the pin
is programmed to be GP3). The VDD is stable before
the Start-up timer times out and there is no problem in
getting a proper Reset. However, Figure 8-5 depicts a
problem situation where VDD rises too slowly. The time
between when the DRT senses that MCLR is high and
when MCLR and VDD actually reach their full value, is
too long. In this situation, when the start-up timer times
out, VDD has not reached the VDD (min) value and the
chip may not function correctly. For such situations, we
recommend that external RC circuits be used to
achieve longer POR delay times (Figure 8-4).
For additional information on design considerations
related to the use of PIC10F220/222 devices with their
short device Reset timer, refer to Application Notes
AN522, “Power-Up Considerations” (DS00522) and
AN607, “Power-up Trouble Shooting” (DS00607).
STATUS Addr: 03h
PCL Addr: 02h
Power-on Reset
0--1 1xxx
1111 1111
MCLR Reset during normal operation
0--u uuuu
1111 1111
MCLR Reset during Sleep
0--1 0uuu
1111 1111
WDT Reset during Sleep
0--0 0uuu
1111 1111
WDT Reset normal operation
0--0 uuuu
1111 1111
Wake-up from Sleep on pin change
1--1 0uuu
1111 1111
Legend: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’.
GP3/MCLR/VPP
MCLRE
Internal MCLR
GPWU
Weak Pull-up
Note:
When the devices start normal operation
(exit the Reset condition), device operat-
ing parameters (voltage, frequency, tem-
perature, etc.) must be met to ensure
proper operation. If these conditions are
not met, the device must be held in Reset
until the operating conditions are met.
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