参数资料
型号: PIC16C620A-04/P301
元件分类: 微控制器/微处理器
英文描述: 8-BIT, OTPROM, 4 MHz, RISC MICROCONTROLLER, PDIP18
封装: 0.300 INCH, PLASTIC, DIP-18
文件页数: 89/108页
文件大小: 674K
代理商: PIC16C620A-04/P301
1998 Microchip Technology Inc.
Preliminary
DS30235G-page 81
PIC16C62X
12.1
DC CHARACTERISTICS:
PIC16C62X-04 (Commercial, Industrial, Extended)
PIC16C62X-20 (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
–40
°C ≤ TA ≤ +85°C for industrial and
0
°C ≤ TA ≤ +70°C for commercial and
–40
°C ≤ TA ≤ +125°C for extended
Param
No.
Sym
Characteristic
Min
Typ Max Units
Conditions
D001
D001A
Vdd
Supply Voltage
3.0
4.5
-
6.0
5.5
V
XT, RC and LP osc conguration
HS osc conguration
D002
Vdr
RAM Data Retention
Voltage (Note 1)
1.5*
V
Device in SLEEP mode
D003
Vpor
VDD start voltage to
ensure Power-on Reset
Vss
V
See section on power-on reset for details
D004
Svdd
VDD rise rate to ensure
Power-on Reset
0.05*
V/ms
See section on power-on reset for details
D005
VBOR
Brown-out Detect Voltage
3.7
4.0
4.3
4.4
V
BOREN conguration bit is cleared
(Extended)
D010
D010A
D013
Idd
Supply Current (Note 2)
1.8
35
9.0
3.3
70
20
mA
A
mA
XT and RC osc conguration
FOSC = 4 MHz, VDD = 5.5V, WDT dis-
abled (Note 4)
LP osc conguration, PIC16C62X-04
only
FOSC = 32 kHz, VDD = 4.0V, WDT dis-
abled
HS osc conguration
FOSC = 20 MHz, VDD = 5.5V, WDT dis-
abled
D020
Ipd
Power Down Current (Note 3)
1.0
2.5
15
A
VDD=4.0V, WDT disabled
(125
°C)
D023
IWDT
IBOR
ICOMP
IVREF
WDT Current (Note 5)
Brown-out Reset Current (Note 5)
Comparator Current for each Com-
parator (Note 5)
VREF Current (Note 5)
6.0
350
20
25
425
100
300
A
VDD=4.0V
(125
°C)
BOR enabled, VDD = 5.0V
VDD = 4.0V
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25
°C, unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1:
This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2:
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specied.
3:
The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
4:
For RC osc conguration, current through Rext is not included. The current through the resistor can be estimated by the
formula Ir = VDD/2Rext (mA) with Rext in k
.
5:
The
current is the additional current consumed when this peripheral is enabled. This current should be added to the
base IDD or IPD measurement.
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