参数资料
型号: ISL6314IRZ-T
厂商: Intersil
文件页数: 10/32页
文件大小: 0K
描述: IC CTRLR PWM 1PHASE BUCK 32-QFN
产品培训模块: Solutions for Industrial Control Applications
标准包装: 6,000
应用: 控制器,Intel VR11,AMD CPU
输入电压: 5 V ~ 12 V
输出数: 1
输出电压: 0.38 V ~ 1.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-QFN 裸露焊盘(5x5)
包装: 带卷 (TR)
ISL6314
( V IN – V OUT ) ? V OUT (EQ. 1)
L ? f S ? V
PHASE (Pin 24)
Connect this pin to the source of the upper MOSFET. This
pin is the return path for the upper MOSFET drive.
LGATE (Pin 21)
This pin is used to control the lower MOSFET. Connect this
pin to the lower MOSFET gate.
SS (Pin 2)
A resistor, R SS , placed from SS to VCC or GND will set the
soft-start ramp slope. Refer to Equations 16 and 17 for
proper resistor calculation.
The state of the SS pin also selects which of the available DAC
tables will be used to decode the VID inputs and puts the
controller into the corresponding mode of operation. For Intel
VR11 mode of operation the R SS resistor should be tied to
GND. AMD compliance is selected if the R SS resistor is tied to
VCC (once in AMD mode, the VID7 bit selects 5-bit DAC if set
to a logic high, or 6-bit DAC if set to a logic low).
PGOOD (Pin 1)
For Intel mode of operation, PGOOD indicates whether VSEN
is within specified overvoltage and undervoltage limits after a
fixed delay from the end of soft-start. If VSEN exceeds these
limits, or if an overcurrent event occurs, or if the part is
disabled, PGOOD is pulled low. PGOOD is always low prior to
the end of soft-start.
For AMD modes of operation, PGOOD will always be high as
long as VSEN is within the specified undervoltage/overvoltage
window and soft-start has ended. PGOOD only goes low if
VSEN is outside this window.
ISENO, ISEN-, and ISEN+ (Pins 14, 15, 16)
ISEN-, ISEN+, and ISENO are the DCR current sense
amplifier’s negative input, positive input, and output
respectively. For accurate DCR current sensing, connect a
resistor from the phase node to ISEN- and connect ISEN+ to
the output inductor, roughly VOUT. A parallel R-C feedback
circuit connected between ISEN- and ISENO will then create
a voltage from ISEN+ to ISENO proportional to the voltage
drop across the inductor DCR. This voltage is referred to as
the droop voltage and is added to the differential
remote-sense amplifier’s output.
An optional 0.001μF to 0.01μF ceramic capacitor can be
placed from the ISEN+ pin to the ISEN- pin to help reduce
common mode noise that might be introduced by the layout.
Operation
Power Conversion
The ISL6314 controller helps simplify implementation by
integrating vital functions and requiring minimal external
components. The “Block Diagram” on page 3 provides a top
level view of the single-phase power conversion using the
ISL6314 controller.
IL, 7A/DIV
PWM, 5V/DIV
1μs/DIV
FIGURE 1. PWM AND INDUCTOR-CURRENT WAVEFORMS
FOR 1-PHASE CONVERTER
Output Ripple
Figure 1 illustrates the output ripple. The PWM current forms
the AC ripple current and the DC load current. The
peak-to-peak current about 7A, and the DC components of
the inductor current feeds the load.
To understand the ripple current amplitude, examine
Equation 1 representing a single channel peak-to-peak
inductor current.
I P-P = ----------------------------------------------------------
IN
In Equation 1, V IN and V OUT are the input and output
voltages respectively, L is the single-channel inductor value,
and f S is the switching frequency.
The output capacitors conduct the ripple component of the
inductor current. Output voltage ripple is a function of
capacitance, capacitor equivalent series resistance (ESR),
and inductor ripple current. Reducing the inductor ripple
current allows the designer to use fewer or less costly output
capacitors. Equation 2 shows the approximation for the
output voltage ripple.
VDIFF (Pin 10)
V P-P = I P-P ? ESR
(EQ. 2)
VDIFF is the output of the differential remote-sense amplifier.
The voltage on this pin is equal to the difference between
VSEN and RGND (VOUT) added to the difference between
ISEN+ and ISENO (droop). VDIFF therefore represents the
VOUT voltage plus the droop voltage. The state of the FS pin
determines whether the droop voltage is added or not.
10
Adaptive Phase Alignment (APA)
To improve the transient response, the ISL6314 implements
Intersil’s proprietary Adaptive Phase Alignment (APA)
technique, which turns on the channel during large current
step transient events.
FN6455.2
October 8, 2009
相关PDF资料
PDF描述
ESM24DRYI-S13 CONN EDGECARD 48POS .156 EXTEND
1944-06M COIL RF .27UH MOLDED UNSHIELDED
ISL95870HRUZ-T IC CTRLR PWM 1PHASE GPU 16UTQFN
MIC5301-2.85YML TR IC REG LDO 2.85V .15A 6-MLF
ISL95870AHRUZ-T IC CTRLR PWM 1PHASE GPU 20UTQFN
相关代理商/技术参数
参数描述
PIC17C4433P 制造商:MICROCHIP 功能描述:*
PIC17C4433PT 制造商:MICROCHIP 功能描述:*
PIC17C44T-16/L 功能描述:8位微控制器 -MCU 16KB 454 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC17C44T-16/PQ 功能描述:8位微控制器 -MCU 16KB 454 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC17C44T-16/PT 功能描述:8位微控制器 -MCU 16KB 454 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT