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| 型号： | R0K561664S001BE |
| 厂商： | Renesas Electronics America |
| 文件页数： | 2/50页 |
| 文件大小： | 0K |
| 描述： | KIT STARTER FOR H8SX/1651 |
| 产品培训模块： | H8S Product Overview H8S Architecture Overview Electromagnetic Noise Reduction Techniques Part 1 |
| 标准包装： | 1 |
| 系列： | H8® |
| 类型： | MCU |
| 适用于相关产品： | H8SX/1651 |
| 所含物品： | CPU 板，LCD 显示模块，E10A 仿真器，缆线，快速入门指南和 CD-ROM |
| 相关产品： | R5F61668RN50FPV-ND - IC H8SX/1668 MCU FLASH 144LQFP R5F61664RN50FPV-ND - IC H8SX/1664 MCU FLASH 144LQFP DF61664W50FPV-ND - IC H8SX/1664 MCU FLASH 144-LQFP DF61663W50FPV-ND - IC H8SX/1663 MCU FLASH 144-LQFP DF61664N50FPV-ND - MCU 3V 512K 144-LQFP DF61663N50FPV-ND - IC H8SX/1663 MCU FLASH 144LQFP |
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TABLE OF CONTENTS
Family Overview . . . . . . . . . . . 2
Top Reasons to Select H8 . . . 4
■ One of the world’s leading ITDM (Integrated
H8 Architecture . . . . . . . . . . . 6
On-chip Peripherals . . . . . . . . 8
Communication Interface . . . 8
Timer s . . . . . . . . . . . . . . . . . . 9
Analog . . . . . . . . . . . . . . . . . 10
Data Tran s fer & Memory . . . 11
Device and Technology Manufacturer)
companies serving the global market
■ In-house manufacturing capability
for advanced process nodes —
90, 65 and 45 nm
■ Complete System-Level Solutions
in all core s egment s (automotive,
mobile, con s umer, indu s trial and PC s ),
with the right mix of technology s uch
#1
Renesas is the
World ’s largest
MCU supplier
with over
21% market
share*
S pecial Function s . . . . . . . . 12
a s
networking (wired/wirele ss ),
s ecurity,
Computer Interface . . . . . . . 13
Development Tools . . . . . . . .14
HEW Overview . . . . . . . . . . . 14
Evaluation S oftware . . . . . . . 15
Debugging S oftware . . . . . . 16
Debugging Hardware . . . . . . 17
Fla s h Programming . . . . . . . 19
Third-party Tool s . . . . . . . . . 19
Tool S elector . . . . . . . . . . . . 20
ICE S election Guide . . . . . . 21
Device Selection . . . . . . . . . 22
H8 S uper Low Power . . . . . 22
H8 Tiny & H8 S Tiny . . . . . . . 24
H8 S /2100 S erie s . . . . . . . . . 26
H8 S /2200 S erie s . . . . . . . . . 28
H8 S /2300 S erie s . . . . . . . . . 30
H8 S /2400 S erie s . . . . . . . . . 34
H8 S /2500 S erie s . . . . . . . . . 36
H8 S /2600 S erie s . . . . . . . . . 38
low power and analog/RF interface capabilitie s ,
plu s full- s cale development s upport
■ Proven credibility based on more than 30 years of experience
— “Zero Defect s ” a s the objective
— Compliance with international s tandard s s uch a s I S O/T S 16949
— High quality te s ted and proven by cu s tomer s (automotive electronic s )
— Commitment to s afety and protection of environment
Renesas — Your Best Decision for
Microcontrollers and Microprocessors
Choose for your next design; use for all your future ones.
Renesas Technology, the #1 global supplier of microcontrollers, offers
hundreds of devices in our M16C ? , H8 ? , and SuperH ? families, among
others, that have solid technology roadmaps and cover wide spans of
performance, integration, power efficiency and price points. Our advanced
silicon solutions simplify system optimizations, facilitate design
enhancements and diversifications, and help you meet tight cost budgets.
You can shorten your system design cycles and improve your time-to-market
by taking advantage of our total system support, which includes starter kits,
HW/SW tools, reference designs/platforms, example software code, and
middleware. Expert third-party support is available as well.
H8 S X/1500 S erie s . . . . . . . . 40
H8 S X/1600 S erie s . . . . . . . . 42
* According to Gartner Dataquest, March 2008
IMPORTANT!
Appendices . . . . . . . . . . . . . 44
Appendix A:
Part Number Decoder s . . . . 44
Appendix B:
Abbreviation s . . . . . Back Flap
Appendix C:
Package
S pecification s . . . . . Back Flap
? This document may, wholly or partially, be subject to change without notice.
? All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
the express permission of Renesas Technology America, Inc.
? Renesas will not be held responsible for any damage to the user that may result from accidents or any other reasons during the
operation of the user’s unit according to this document.
? Circuitry and other examples described herein are meant merely to indicate the characteristics and performance of Renesas
semiconductor products. Renesas assumes no responsibility for any intellectual property claims or other problems that may
result from applications based on the examples described herein.
? No license is granted by implication or otherwise under any patents or other rights of any third party or Renesas Technology Corp.
? MEDICAL APPLICATIONS:
Renesas products are not authorized for use in MEDICAL APPLICATIONS without the written consent of the appropriate
officer of Renesas’ sales company. Such use includes, but is not limited to, use in life support systems. Buyers of Renesas products
are requested to notify the relevant Renesas sales officers when planning to use the products in MEDICAL APPLICATIONS.
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