
RX
4571 LC
Page - 3
ETM18E-04
4. External Dimensions / Marking Layout
4.1. External Dimensions
RX
4571 LC ( VSOJ 12pin )
External dimensions
Recommended soldering pattern
Unit : mm
2.
4
# 12
# 7
# 1
# 6
0.5
0.22
0.08 M
3.6 ± 0.2
(
0.
4
)
2.
8
±
0.
2
0.1
0
Mi
n
.
1.2
Ma
x.
0.08
2.5
2.77
0.
8
0.8
1.
6
3.
2
0.27
0.5
2.
4
This product uses a molded package whose back contains glass.
Carefully note the following cautions when handling.
Notes on packaging
This product uses a molded package whose back contains glass.
Carefully note the following cautions when handling.
(1) Packaging equipment
This product uses a molded package whose back contains glass.
Therefore, it is possible for shocks during packaging to cause product breakage, depending on the packaging machinery and conditions.
Please be sure to check that the load placed on products during packaging is as low as possible (low speeds during loading onto the
substrate, low chuck forces, etc.) before using packaging equipment.
Carry out the same checks when changing packaging conditions.
The presence of foreign objects between this product and the packaging substrate may result in product breakage.
Guard against introduction of foreign objects during packaging.
Also, carry out measures to eliminate static electricity during packaging of and operations with this product.
(2) Stop using the glue
Any glue must never use it after soldering RTC to a circuit board.
This product has glass on the back side of a package.
When glue invasions between circuit board side and glass side, then glass cracks by thermal expansion of glue.
In this case a crystal oscillation stops.
Consider glue abolition or glue do not touch to this product.
4.2. Marking Layout
RX
4571 LC ( VSOJ 12pin )
#1 Pin Mark
Logo
Production lot
E 4571
A123B
Type
Contents displayed indicate the general markings and display, but are not the standards for the fonts, sizes and positioning.