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参数资料
| 型号： | S1C63158B0A010R |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 4-BIT, FLASH, 4 MHz, MICROCONTROLLER, PBGA |
| 文件页数： | 42/159页 |
| 文件大小： | 1200K |
| 代理商： | S1C63158B0A010R |
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128
EPSON
S1C63808 TECHNICAL MANUAL
CHAPTER 5: SUMMARY OF NOTES
<Arrangement of Signal Lines>
● In order to prevent generation of electromagnetic induction noise caused by mutual inductance, do
not arrange a large current signal line near the circuits that are sensitive to noise such as the oscillation
unit.
● When a signal line is parallel with a high-speed line in long distance or intersects a high-speed line,
noise may generated by mutual interference between the signals and it may cause a malfunction.
Do not arrange a high-speed signal line especially near circuits that are sensitive to noise such as the
oscillation unit.
OSC4
OSC3
VSS
Large current signal line
High-speed signal line
Prohibited pattern example
<Output Terminals>
● When an output terminal is used to drive an external component that consumes a large amount of
current, the operation of the external component affects the built-in power supply circuit of this IC
and the output voltage may vary. When driving a bipolar transistor by a periodic signal such as the
BZ or timer output in particular, it may cause variations in the voltage output from the EPD system
voltage circuit that affects the EPD contrast. To prevent this, separate the traces on the printed circuit
board. Put one between the power supply and the IC's VDD and VSS terminals, and another between
the power supply and the external component that consumes the large amount of current. Further-
more, use an external component with as low a current consumption as possible.
VDD
VSS
Piezo
BZ
CP
Example: Buzzer output circuit
+
<Precautions for Visible Radiation (when bare chip is mounted)>
● Visible radiation causes semiconductor devices to change the electrical characteristics. It may cause
this IC to malfunction. When developing products which use this IC, consider the following precau-
tions to prevent malfunctions caused by visible radiations.
(1) Design the product and implement the IC on the board so that it is shielded from visible radiation
in actual use.
(2) The inspection process of the product needs an environment that shields the IC from visible
radiation.
(3) As well as the face of the IC, shield the back and side too.
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