参数资料
型号: S1D13600F00A
元件分类: 显示控制器
英文描述: CRT OR FLAT PNL GRPH DSPL CTLR, PQFP64
封装: QFP6-64
文件页数: 22/29页
文件大小: 190K
代理商: S1D13600F00A
S1D13600 Series
Rev. 2.3
EPSON
1–29
LP Configuration
command; DT/
CM = 0
D7
D6
D5
D4
D3
D2
D1
D0
0
00010
00
08H
(1) This command selects “LP” period.
(2) FS1,0 select the period of the signal “LP”. The following table shows how to select the required
frequency for the signal “LP”.
(3) FS [1,0] = [0,0] is set when the “
RESET” signal is set LOW.
data; DT/
CM = 1
0
00000
FS1
FS0
data1
Table 19. LP Frequency
FS1
FS0
LP frequency
00
fOSC
01
fOSC/2
10
fOSC/4
11
fOSC/8
11. ERRORTA
This version has one error. About CPU Write Start Address, Values which CPU wrote is increased by one.
So, you should set values which is decreased by one.
12. NOTICE
No parts of this material may be reproduced or duplicated in any form or by any means without the written
permission of Seiko Epspn. Seiko Epson reserves the right to make changes to this material without notice.
Seiko Epson does not assume any liability of any kind aristing out of any inaccuracies contained in this
material or due to its application or use in any product or circuit and, further, there is no representation that
this material is applicable to products requiring high level reliability, such as, medical products. Moreover,
no license to any intellectual property rights is granted by implication or otherwise, and there is no
representation or warranty what anything made in accordance with this material will be free from any
patent or copyright infringement of a third party. This material or portions there of may contain technology
or the subject relating to strategic products under the control of the Foreign Exchange and Foreign Trade
Control Law of Japan and may require an export license from the Ministry of International Trade and
Industry or other approval from another government agency.
Pay attention to the following point when using a semiconductor device. A semiconductor device will be
deteriorated in its characteristic when it is exposed to light. For this reason, this IC might malfunction in
some cases when exposed to the light. To avoid causing such malfunction, steps be taken to shield the light
in its packaging or enclosure to prevent the surface, rear and side of this IC from being exposed to the light.
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