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参数资料
| 型号： | SA58637BS |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 音频放大器 |
| 英文描述： | 2 x 2.2 W BTL audio amplifier |
| 封装： | SA58637BS<SOT910-1 (HVQFN20)|<<http://www.nxp.com/packages/SOT910-1.html<1<Always Pb-free,; |
| 文件页数： | 11/22页 |
| 文件大小： | 156K |
| 代理商： | SA58637BS |
SA58637_1
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 25 February 2008
19 of 22
NXP Semiconductors
SA58637
2
× 2.2 W BTL audio amplier
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 18) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 9 and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 18.
Table 9.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 10.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SA58637BS,118 | 功能描述:音频放大器 DUAL 2.2W/CH. BTL RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| SA58637BS118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 2.2W SON-20 |
| SA58637BS-T | 功能描述:音频放大器 DUAL 2.2W/CH. BTL AUDIO AMP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| SA58640 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-voltage mixer FM IF system |
| SA58640DK | 功能描述:射频混合器 NB FM IF RECEIVER RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
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