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参数资料
| 型号： | SA58637BS |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 音频放大器 |
| 英文描述： | 2 x 2.2 W BTL audio amplifier |
| 封装： | SA58637BS<SOT910-1 (HVQFN20)|<<http://www.nxp.com/packages/SOT910-1.html<1<Always Pb-free,; |
| 文件页数： | 4/22页 |
| 文件大小： | 156K |
| 代理商： | SA58637BS |
SA58637_1
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 25 February 2008
12 of 22
NXP Semiconductors
SA58637
2
× 2.2 W BTL audio amplier
14.3 Thermal behavior
The measured thermal performance of the HVQFN20 package is highly dependent on the
conguration and size of the heat spreader on the application demo board. Data may not
be comparable between different semiconductor manufacturers because the application
demo boards and test methods are not standardized. The thermal performance of a
package for a specic application may also differ from those presented here because the
conguration of the application boards copper heat spreader may be signicantly different.
NXP Semiconductors uses FR-4 type application boards with 28.3 g (1 oz) copper traces
with solder coating.
The demo board (see Figure 16) has a 28.3 g (1 oz) copper heat spreader that runs under
the IC and provides a mounting pad to solder to the die attach paddle of the HVQFN20
package. The heat spreader is symmetrical and provides a heat spreader on both top and
bottom of the PCB. The heat spreader on top and bottom side of the demo board is
connected through 2 mm diameter plated through holes. Directly under the DAP (Die
Attach Paddle), the top and bottom side of the PCB are connected by four vias. The total
top and bottom heat spreader area is 64.5 mm2 (10 in2).
The junction to ambient thermal resistance, Rth(j-a) = 22 K/W for the HVQFN20 package
when the exposed die attach paddle is soldered to a 32.3 mm2 (5 in2) area of 28.3 g (1 oz)
copper heat spreader on the demo PCB. The maximum sine wave power dissipation for
Tamb =25 °C is:
Thus, for Tamb =60 °C the maximum total power dissipation is:
The power dissipation as a function of ambient temperature curve (Figure 11) shows the
power derating proles with ambient temperature for three sizes of heat spreaders. For a
more modest heat spreader using a 32.3 mm2 (5 in2) area on the top or bottom side of the
PCB, the Rth(j-a) is 31 K/W. When the package is not soldered to a heat spreader, the
Rth(j-a) increases to 60 K/W.
150
25
–
22
---------------------
5.7 W
=
150
60
–
22
---------------------
4.1 W
=
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SA58637BS,118 | 功能描述:音频放大器 DUAL 2.2W/CH. BTL RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| SA58637BS118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 2.2W SON-20 |
| SA58637BS-T | 功能描述:音频放大器 DUAL 2.2W/CH. BTL AUDIO AMP RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| SA58640 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-voltage mixer FM IF system |
| SA58640DK | 功能描述:射频混合器 NB FM IF RECEIVER RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
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