参数资料
型号: SA58637BS
厂商: NXP Semiconductors N.V.
元件分类: 音频放大器
英文描述: 2 x 2.2 W BTL audio amplifier
封装: SA58637BS<SOT910-1 (HVQFN20)|<<http://www.nxp.com/packages/SOT910-1.html<1<Always Pb-free,;
文件页数: 13/22页
文件大小: 156K
代理商: SA58637BS
SA58637_1
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 25 February 2008
20 of 22
NXP Semiconductors
SA58637
2
× 2.2 W BTL audio amplier
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
17. Abbreviations
18. Revision history
MSL: Moisture Sensitivity Level
Fig 18. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 11.
Abbreviations
Acronym
Description
BTL
Bridge-Tied Load
CMOS
Complementary Metal Oxide Semiconductor
DAP
Die Attach Paddle
ESD
ElectroStatic Discharge
HF
High-Frequency
NPN
Negative-Positive-Negative
PCB
Printed-Circuit Board
PNP
Positive-Negative-Positive
RMS
Root Mean Squared
SE
Single-Ended
THD
Total Harmonic Distortion
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SA58637_1
20080225
Product data sheet
-
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