- 您现在的位置：买卖IC网 > PDF目录98078 > SC16C550IB48,128 (NXP SEMICONDUCTORS) 1 CHANNEL(S), 3M bps, SERIAL COMM CONTROLLER, PQFP48 PDF资料下载
参数资料
| 型号： | SC16C550IB48,128 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 1 CHANNEL(S), 3M bps, SERIAL COMM CONTROLLER, PQFP48 |
| 封装： | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-313-2, LQFP-48 |
| 文件页数： | 42/52页 |
| 文件大小： | 639K |
| 代理商： | SC16C550IB48,128 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页当前第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页
Philips Semiconductors
SC16C550
UART with 16-byte FIFO and IrDA encoder/decoder
Product data
Rev. 05 — 19 June 2003
47 of 52
9397 750 11619
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
12. Soldering
12.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,
but it is not suitable for ne pitch SMDs. In these situations reow soldering is
recommended. Driven by legislation and environmental forces the worldwide use of
lead-free solder pastes is increasing.
12.2 Through-hole mount packages
12.2.1
Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°C or
265
°C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specied maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
12.2.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°C, contact may be up to 5 seconds.
12.3 Surface mount packages
12.3.1
Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 220
°C (SnPb process) or below 245 °C (Pb-free process)
– for all the BGA and SSOP-T packages
相关PDF资料 |
PDF描述 |
|---|---|
| SC16C654IB64,128 | 4 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQFP64 |
| SC16C654IA68,512 | 4 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC68 |
| SC18005CQ | SPECIALTY MICROPROCESSOR CIRCUIT, PQFP144 |
| SC18IS600IBS,151 | I2C BUS CONTROLLER, PQCC24 |
| SC18IS600IBS | I2C BUS CONTROLLER, PQCC24 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SC16C550IN40 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Universal Asynchronous Receiver/Transmitter (UART) with 16-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C550IN40,112 | 功能描述:IC UART SINGLE W/FIFO 40-DIP RoHS:是 类别:集成电路 (IC) >> 接口 - UART（通用异步接收器/发送器） 系列:- 标准包装:250 系列:- 特点:* 通道数:2，DUART FIFO's:16 字节 规程:RS232，RS485 电源电压:2.25 V ~ 5.5 V 带并行端口:- 带自动流量控制功能:是 带IrDA 编码器/解码器:是 带故障启动位检测功能:是 带调制解调器控制功能:是 带CMOS:是 安装类型:表面贴装 封装/外壳:48-TQFP 供应商设备封装:48-TQFP（7x7） 包装:托盘 其它名称:XR16L2551IM-F-ND |
| SC16C554 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder |
| SC16C554B | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs |
| SC16C554B_10 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs |
发布紧急采购，3分钟左右您将得到回复。