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| 型号： | SC18IM700IPW |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 连接器件 |
| 英文描述： | Master I?C-bus controller with UART interface |
| 封装： | SC18IM700IPW<SOT403-1 (TSSOP16)|<<http://www.nxp.com/packages/SOT403-1.html<1<Always Pb-free,;SC18IM700IPW<SOT403-1 (TSSOP16)|<<http://www.nxp.com/packages/SOT403-1.html& |
| 文件页数： | 18/22页 |
| 文件大小： | 118K |
| 代理商： | SC18IM700IPW |
SC18IM700_2
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 10 August 2007
18 of 22
NXP Semiconductors
SC18IM700
Master I
2
C-bus controller with UART interface
14. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SC18IM700IPW,112 | 功能描述:UART 接口集成电路 CTRL I2C W/UART RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC18IM700IPW,128 | 功能描述:UART 接口集成电路 UART-MASTER I2C RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
| SC18IM700IPW/S8HP | 功能描述:IC CTRL I2CW/UART 16TSSOP 制造商:nxp usa inc. 系列:- 零件状态:在售 协议:I2C 功能:控制器 接口:UART 标准:- 电压 - 电源:2.4 V ~ 3.6 V 电流 - 电源:9mA 工作温度:-40°C ~ 85°C 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商器件封装:16-TSSOP 标准包装:1 |
| SC18IM700IPW112 | 制造商:NXP Semiconductors 功能描述:IC I2C BUS TO UART INTERFACE TSSOP-16 制造商:NXP Semiconductors 功能描述:IC I2C BUS-UART INTERFACE 16TSSOP |
| SC18IM700IPW-F | 功能描述:UART 接口集成电路 UART-MASTER I2C BRIDGE W/GPIO RoHS:否 制造商:Texas Instruments 通道数量:2 数据速率:3 Mbps 电源电压-最大:3.6 V 电源电压-最小:2.7 V 电源电流:20 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LQFP-48 封装:Reel |
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